Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Solder Joint Reliability Qualification of Various Component Mounting Modification Configurations Using Thermal Cycle Testing
The selection and use of solder joint modification configurations for printed wiring assemblies has traditionally been a design
specific activity. The implementation and use of a standardized s
.. read more
Characterization of PCB Plated-Thru-Hole Reliability using Statistical Analysis
Various test methods are used to characterize the PCB plated-thru-hole reliability. One such method is the Interconnect Stress
Test (IST). The results from this test are often used to qualify P
.. read more
Reliability Assessment of CSP Underfill Methods
The miniaturization trend in electronics has proliferated the use of Chip Scale Packages (CSPs) in electronics assembly. CSPs
used in portable devices are subjected to harsh mechanical and ther
.. read more
Reliability of High Density,High Layer Count,Multilayer Backplanes
This paper discusses the work and testing performed to obtain extreme high reliability performance from high layer count,
large panel format multilayer printed wiring boards that are used for b
.. read more
Embedded Passives in High Layer Count High Reliability Printed Wiring Boards
This paper will discuss the use of thin film buried resistors and thin core plane pairs in high layer count high reliability
printed wiring boards used in single and double sided surface mount
.. read more
New Developments in Polymer Thick Film Resistor Technology
Motorola has been using embedded polymer thick film resistors on immersion silver-plated copper terminations in products
for four years,and in the past year other firms have begun using this te
.. read more
Printed Circuit Board Reliability in High Temperature
This paper will demonstrate the effect high reflow temperatures in lead free processes will have on the reliability of printed
circuit boards from a broad range of laminate materials for both t
.. read more
PCB Materials Behaviours towards Humidity and Impact of the Design,Finishes,Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability
As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and
process controls but also risks knowledge. To overcome humidity issue,par
.. read more
Using Periodic Pulse Reverse (PPR) for Plating Thick Panel Applications
There is increased interest in the printed wiring board (PWB) industry with regards to the use of periodic pulse reverse (PPR)
plating to electroplate printed circuit boards. PPR plating offers
.. read more
A Reliability Comparison of Different Lead-Free Alloys and Surface Finishes in SMT Assembly
As we inch towards the somewhat shifting deadlines towards lead (Pb) restriction in Japan and Europe,there is an increase
seen in the amount of studies performed for electronics assemblies sold
.. read more
Assembly,Rework and Reliability of Lead-free FCBGA Soldered Component
Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has
passed legislation requiring the removal of lead from electronics assembly b
.. read more
Study of Assembly Processes for Solder Flip Chips on FR-4 Substrates
Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip
interconnection types including anisotropic conductive film or
.. read more
MEMS-Based Microsystem Packaging
Sandia National Laboratories has programs covering
the range of MEMS technologies from LIGA to bulk
to surface micromachining. These MEMS
technologies are being considered for an equally
broad
.. read more
Enhancement of CSP Mechanical Strength using Underfill or Bonding Material
Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion (CTE)
in flip chip technology. An extension of this application has been used to increase the
.. read more
Implementation of No-Flow Underfills on Chip Scale Packages
Chip Scale Package (CSP) technology is growing at a rapid pace since its emergence in the electronics
manufacturing industry. As the solder joint size decreases,it has become apparent that unde
.. read more
Evaluating the Use of Next Generation Reflow Profile Control for High Volume Electronics Manufacturing
In recent years,technological advances in electronics manufacturing have allowed high volume manufacturers to
significantly improve process control and documentation. Manufacturers have acceler
.. read more
Robust Optimization of a Lead Free SMT Process
This paper will focus on Dr. Taguchi’s Robust Engineering methodology,measurement methods and experimental
results for the optimization of a lead free SMT process for use in an Automotive Elect
.. read more
Soldering Fluxes and the Repair Process
Wave soldering fluxes are currently used in hand soldering operations as a matter of course and with little
regard for flux deposition amounts. This use has led to the investigation of fluxes u
.. read more
Flip Chip Processing Solutions as used in System in Package Applications
Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics
industries. Changes that demand common and pervasive requirements for active assemblies such
.. read more
New Insights in Underfill Flow and Flip Chip Reliability
During the last years Flip Chip Technology has been widely accepted as a means for maximum miniaturization of
microelectronic assemblies. As an example the use of Flip Chips in advanced product
.. read more
Copper Surface Treatment and Plating Reliability
Reliable copper interconnects are a primary requirement for most printed wiring board applications. A variety of
wet manufacturing processes play an important role in the formation of durable i
.. read more
Benchmarking PCB Process Capability,Quality and Reliability Becomes a Reality
The IPC-PCQR2 (Process Capability,Quality and Relative Reliability) program has developed a library of process
capability panel designs,and a database that details the manufacturing capability,
.. read more
Board Level Manufacturability and Reliability Assessment of 0.5 mm Wafer Level CSP with Over-Sized Balls
The endless quest for increased performance in less space has recently manifested itself in 0.5mm pitch Chip Scale
Packages (CSP). The footprints of these packages are only about half the size
.. read more
Use of Underfill to Enhance the Thermal Cycling Reliability of Small BGAs
In this work,we have evaluated the use of underfill to enhance the reliability of small BGAs in the automotive
thermal cycling environment. Best parameters for underfilling of BGAs were develop
.. read more
Solder Joint Reliability Qualification of Various Component Mounting Modification Configurations Using Thermal Cycle Testing
The selection and use of solder joint modification configurations for printed wiring assemblies has traditionally been a design
specific activity. The implementation and use of a standardized s
.. read more
Characterization of PCB Plated-Thru-Hole Reliability using Statistical Analysis
Various test methods are used to characterize the PCB plated-thru-hole reliability. One such method is the Interconnect Stress
Test (IST). The results from this test are often used to qualify P
.. read more
Reliability Assessment of CSP Underfill Methods
The miniaturization trend in electronics has proliferated the use of Chip Scale Packages (CSPs) in electronics assembly. CSPs
used in portable devices are subjected to harsh mechanical and ther
.. read more
Reliability of High Density,High Layer Count,Multilayer Backplanes
This paper discusses the work and testing performed to obtain extreme high reliability performance from high layer count,
large panel format multilayer printed wiring boards that are used for b
.. read more
Embedded Passives in High Layer Count High Reliability Printed Wiring Boards
This paper will discuss the use of thin film buried resistors and thin core plane pairs in high layer count high reliability
printed wiring boards used in single and double sided surface mount
.. read more
New Developments in Polymer Thick Film Resistor Technology
Motorola has been using embedded polymer thick film resistors on immersion silver-plated copper terminations in products
for four years,and in the past year other firms have begun using this te
.. read more
Printed Circuit Board Reliability in High Temperature
This paper will demonstrate the effect high reflow temperatures in lead free processes will have on the reliability of printed
circuit boards from a broad range of laminate materials for both t
.. read more
PCB Materials Behaviours towards Humidity and Impact of the Design,Finishes,Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability
As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and
process controls but also risks knowledge. To overcome humidity issue,par
.. read more
Using Periodic Pulse Reverse (PPR) for Plating Thick Panel Applications
There is increased interest in the printed wiring board (PWB) industry with regards to the use of periodic pulse reverse (PPR)
plating to electroplate printed circuit boards. PPR plating offers
.. read more
A Reliability Comparison of Different Lead-Free Alloys and Surface Finishes in SMT Assembly
As we inch towards the somewhat shifting deadlines towards lead (Pb) restriction in Japan and Europe,there is an increase
seen in the amount of studies performed for electronics assemblies sold
.. read more
Assembly,Rework and Reliability of Lead-free FCBGA Soldered Component
Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has
passed legislation requiring the removal of lead from electronics assembly b
.. read more
Study of Assembly Processes for Solder Flip Chips on FR-4 Substrates
Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip
interconnection types including anisotropic conductive film or
.. read more
MEMS-Based Microsystem Packaging
Sandia National Laboratories has programs covering
the range of MEMS technologies from LIGA to bulk
to surface micromachining. These MEMS
technologies are being considered for an equally
broad
.. read more
Enhancement of CSP Mechanical Strength using Underfill or Bonding Material
Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion (CTE)
in flip chip technology. An extension of this application has been used to increase the
.. read more
Implementation of No-Flow Underfills on Chip Scale Packages
Chip Scale Package (CSP) technology is growing at a rapid pace since its emergence in the electronics
manufacturing industry. As the solder joint size decreases,it has become apparent that unde
.. read more
Evaluating the Use of Next Generation Reflow Profile Control for High Volume Electronics Manufacturing
In recent years,technological advances in electronics manufacturing have allowed high volume manufacturers to
significantly improve process control and documentation. Manufacturers have acceler
.. read more
Robust Optimization of a Lead Free SMT Process
This paper will focus on Dr. Taguchi’s Robust Engineering methodology,measurement methods and experimental
results for the optimization of a lead free SMT process for use in an Automotive Elect
.. read more
Soldering Fluxes and the Repair Process
Wave soldering fluxes are currently used in hand soldering operations as a matter of course and with little
regard for flux deposition amounts. This use has led to the investigation of fluxes u
.. read more
Flip Chip Processing Solutions as used in System in Package Applications
Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics
industries. Changes that demand common and pervasive requirements for active assemblies such
.. read more
New Insights in Underfill Flow and Flip Chip Reliability
During the last years Flip Chip Technology has been widely accepted as a means for maximum miniaturization of
microelectronic assemblies. As an example the use of Flip Chips in advanced product
.. read more
Copper Surface Treatment and Plating Reliability
Reliable copper interconnects are a primary requirement for most printed wiring board applications. A variety of
wet manufacturing processes play an important role in the formation of durable i
.. read more
Benchmarking PCB Process Capability,Quality and Reliability Becomes a Reality
The IPC-PCQR2 (Process Capability,Quality and Relative Reliability) program has developed a library of process
capability panel designs,and a database that details the manufacturing capability,
.. read more
Board Level Manufacturability and Reliability Assessment of 0.5 mm Wafer Level CSP with Over-Sized Balls
The endless quest for increased performance in less space has recently manifested itself in 0.5mm pitch Chip Scale
Packages (CSP). The footprints of these packages are only about half the size
.. read more
Use of Underfill to Enhance the Thermal Cycling Reliability of Small BGAs
In this work,we have evaluated the use of underfill to enhance the reliability of small BGAs in the automotive
thermal cycling environment. Best parameters for underfilling of BGAs were develop
.. read more