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IPC Solder Products Value Council (SPVC) Lead-Free Technical Subcommittee Report: Take Action Limits (TAL) for SAC305 Lead Free Automated Soldering...
At present there are a large number of materials that have been proposed as replacements for lead containing solder for reflow and wave and selective soldering.
Unlike solder paste in a reflow
.. read more
A Study of Solder Optimization Development for Portable Electronic Device
With increasing use of portable appliances such as PDA and cellular phone,changing environment of application requires higher solder joint reliability. The Cu-OSP process has been widely used f
.. read more
Comparison of Thermal Fatigue Performance of SAC105 (Sn-1.0Ag-0.5Cu),Sn- 3.5Ag,and SAC305 (Sn-3.0Ag-0.5Cu) BGA Components with SAC305 Solder Paste
Many BGA and CSP component suppliers have begun shipment of components with a variety of “second generation” Pb-free solder ball alloys. Much of the motivation for the alloy changes has been to
.. read more
Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies
The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability
.. read more
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more
Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders
Current leakage on a printed circuit board (PCB) can occur due to a reduction in surface insulation resistance (SIR) between adjacent conductors. This is frequently caused by electrochemical mi
.. read more
Comparison of Copper Erosion at Plated Through-Hole Knees in Motherboards Using SAC305 and an SnCuNiGe Alternative Alloy for Wave Soldering...
Copper erosion from plated through holes (PTH) barrels in printed circuit boards (PCB) during both wave soldering and mini-pot rework can increase the risk of PTH reliability failures during fi
.. read more
Case Study on the Validation of SAC305 and SnCu Based Solders in SMT,Wave and Hand-soldering at the Contract Assembler Level
insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow,wave soldering
and hand assembly processes must all be optimized carefully to insure go
.. read more
Investigation into the Mass Imaging aspects of 0.3mm Wafer Level Chip Scale Package solder paste deposition
fast approaching this horizon is the 0.3mm CSP. This device represents a major assembly revolution within the Surface mount assembly (SMT) arena. The implementation of this device will require
.. read more
Measuring the True Wetting Time of Solders
As the electronics industry prepares to meet the requirements of the European Community’s RoHS directive on lead in electrical and electronic equipment an issue about which concern is frequentl
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more
Performance of China Alloy SnAgCuCe in Reflow Soldering
Work on assisting China's Ministry of Information Industry (MII) to assess the performance of a solder paste using the China alloy Sn3.0Ag0.5Cu0.019Ce (SACCe) was completed. Two Indium fluxes w
.. read more
Reliability of Partially Filled SAC305 Through-Hole Joints
Consistently achieving acceptable wave solder through-hole fill on thick boards is a well-known process challenge,but the
introduction of lead free solders has created additional difficulties.
.. read more
Dynamics in Lead-Free Wave Soldering
The following report is fundamentally focused on how three popular lead-free alloys react in a wave solder application. The alloys were SAC305,SAC405 and a proprietary,low silver SAC alloy. In
.. read more
IPC Solder Products Value Council (SPVC) Lead-Free Technical Subcommittee Report: Take Action Limits (TAL) for SAC305 Lead Free Automated Soldering...
At present there are a large number of materials that have been proposed as replacements for lead containing solder for reflow and wave and selective soldering.
Unlike solder paste in a reflow
.. read more
A Study of Solder Optimization Development for Portable Electronic Device
With increasing use of portable appliances such as PDA and cellular phone,changing environment of application requires higher solder joint reliability. The Cu-OSP process has been widely used f
.. read more
Comparison of Thermal Fatigue Performance of SAC105 (Sn-1.0Ag-0.5Cu),Sn- 3.5Ag,and SAC305 (Sn-3.0Ag-0.5Cu) BGA Components with SAC305 Solder Paste
Many BGA and CSP component suppliers have begun shipment of components with a variety of “second generation” Pb-free solder ball alloys. Much of the motivation for the alloy changes has been to
.. read more
Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies
The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability
.. read more
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more
Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders
Current leakage on a printed circuit board (PCB) can occur due to a reduction in surface insulation resistance (SIR) between adjacent conductors. This is frequently caused by electrochemical mi
.. read more
Comparison of Copper Erosion at Plated Through-Hole Knees in Motherboards Using SAC305 and an SnCuNiGe Alternative Alloy for Wave Soldering...
Copper erosion from plated through holes (PTH) barrels in printed circuit boards (PCB) during both wave soldering and mini-pot rework can increase the risk of PTH reliability failures during fi
.. read more
Case Study on the Validation of SAC305 and SnCu Based Solders in SMT,Wave and Hand-soldering at the Contract Assembler Level
insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow,wave soldering
and hand assembly processes must all be optimized carefully to insure go
.. read more
Investigation into the Mass Imaging aspects of 0.3mm Wafer Level Chip Scale Package solder paste deposition
fast approaching this horizon is the 0.3mm CSP. This device represents a major assembly revolution within the Surface mount assembly (SMT) arena. The implementation of this device will require
.. read more
Measuring the True Wetting Time of Solders
As the electronics industry prepares to meet the requirements of the European Community’s RoHS directive on lead in electrical and electronic equipment an issue about which concern is frequentl
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more
Performance of China Alloy SnAgCuCe in Reflow Soldering
Work on assisting China's Ministry of Information Industry (MII) to assess the performance of a solder paste using the China alloy Sn3.0Ag0.5Cu0.019Ce (SACCe) was completed. Two Indium fluxes w
.. read more
Reliability of Partially Filled SAC305 Through-Hole Joints
Consistently achieving acceptable wave solder through-hole fill on thick boards is a well-known process challenge,but the
introduction of lead free solders has created additional difficulties.
.. read more
Dynamics in Lead-Free Wave Soldering
The following report is fundamentally focused on how three popular lead-free alloys react in a wave solder application. The alloys were SAC305,SAC405 and a proprietary,low silver SAC alloy. In
.. read more