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BGA Mounting Using Improved Solder Columns
BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the
BGAs,which results in a TCE Mismatch between the components. If such an assembl
.. read more
The Effect of Via-in-Pad Via-Fill on Solder Joint Void Formation
Fabricators,and the copper plating process they choose,can have considerable influence on their customers' solder joint
reliability. In the case of high density assemblies,via-in-pad designs of
.. read more
Capabilities of Tools Used to Measure Voids to Industry Standards
It is stated that some degree of voiding is acceptable and inevitable when soldering electronic components,and
specifically BGAs. There have been many publications which discuss this phenomena,
.. read more
Solder Joint Thermal Fatigue Damage Evaluation by a Simplified Method
In the present study,a simplified analysis methodology is used to evaluate thermal fatigue damage of solder joints of
a leadless ceramic chip carrier (LCCC) or a leadless chip capacitor/resisto
.. read more
PWB Final Surface Treatment Process and Film Characteristics that Satisfy Lead-free Solder Mounting
Because of environmental concerns,elimination of lead from electronic components has been recently encouraged,and as a result,lead-free solders are frequently adopted for solder mounting. The O
.. read more
BGA Mounting Using Improved Solder Columns
BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the
BGAs,which results in a TCE Mismatch between the components. If such an assembl
.. read more
The Effect of Via-in-Pad Via-Fill on Solder Joint Void Formation
Fabricators,and the copper plating process they choose,can have considerable influence on their customers' solder joint
reliability. In the case of high density assemblies,via-in-pad designs of
.. read more
Capabilities of Tools Used to Measure Voids to Industry Standards
It is stated that some degree of voiding is acceptable and inevitable when soldering electronic components,and
specifically BGAs. There have been many publications which discuss this phenomena,
.. read more
Solder Joint Thermal Fatigue Damage Evaluation by a Simplified Method
In the present study,a simplified analysis methodology is used to evaluate thermal fatigue damage of solder joints of
a leadless ceramic chip carrier (LCCC) or a leadless chip capacitor/resisto
.. read more
PWB Final Surface Treatment Process and Film Characteristics that Satisfy Lead-free Solder Mounting
Because of environmental concerns,elimination of lead from electronic components has been recently encouraged,and as a result,lead-free solders are frequently adopted for solder mounting. The O
.. read more