Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders
Current leakage on a printed circuit board (PCB) can occur due to a reduction in surface insulation resistance (SIR) between adjacent conductors. This is frequently caused by electrochemical mi
.. read more
The Digital Solder Paste
Since the beginning of Surface Mount Technology over 40 years ago solder paste has been an integral element in electronics assembly. Historically solder paste design and development has been,in
.. read more
The Digital Solder Paste
Since the beginning of Surface Mount Technology over 40 years ago solder paste has been an integral element in electronics assembly. Historically solder paste design and development has been,in
.. read more
Cleaning Qualification Methodology for Inline Aqueous Assembly Process
An assessment to measure the cleanliness of the area underneath a component has been completed. The assessment uses an 8”×9”×0.093” test vehicle with FR4 laminate,OSP surface finishing,and 21 p
.. read more
Methods for Choosing a Saponifier or Surfactant for Printed Circuit Board and Stencil Cleaning Applications
This paper will discuss the technical challenges associated with the selection of chemical additive for the printed circuit board assembly (PCBA) and stencil cleaning processes. The removal of
.. read more
The Role of Permeability and Ion Transport In Conformal Coating Protection
The level of protection offered by a range of conformal coatings on electronic assemblies has been evaluated. The role of permeability and ion transport is the primary interest. Testing was car
.. read more
Process Qualification Using the IPC-B-52 Standard Test Assembly
Many professionals in the electronics manufacturing industry have,or eventually will,face the issue of determining
whether the materials of construction for printed wiring assemblies (PWAs) are
.. read more
Removal of Palladium Residue in Semi-Additive Process for Enhanced Reliability in
In order to satisfy the ever-increasing demand for smaller and lighter electronic devices,a drastic miniaturization is making
rapid progresses for even circuit features on printed wiring boards
.. read more
The Chemistry and Properties of a Newly Developed Immersion Silver Coating for PWB
To meet the emerging requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating
from hot-air-leveled SnPb solder to alternative final finishes. A thin
.. read more
Are Lead-free Assemblies Especially Endangered by Climatic Safety?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide
move toward lead-free manufacturing,has initiated a closer scrutiny towards e
.. read more
Soldering Fluxes and the Repair Process
Wave soldering fluxes are currently used in hand soldering operations as a matter of course and with little
regard for flux deposition amounts. This use has led to the investigation of fluxes u
.. read more
Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders
Current leakage on a printed circuit board (PCB) can occur due to a reduction in surface insulation resistance (SIR) between adjacent conductors. This is frequently caused by electrochemical mi
.. read more
The Digital Solder Paste
Since the beginning of Surface Mount Technology over 40 years ago solder paste has been an integral element in electronics assembly. Historically solder paste design and development has been,in
.. read more
The Digital Solder Paste
Since the beginning of Surface Mount Technology over 40 years ago solder paste has been an integral element in electronics assembly. Historically solder paste design and development has been,in
.. read more
Cleaning Qualification Methodology for Inline Aqueous Assembly Process
An assessment to measure the cleanliness of the area underneath a component has been completed. The assessment uses an 8”×9”×0.093” test vehicle with FR4 laminate,OSP surface finishing,and 21 p
.. read more
Methods for Choosing a Saponifier or Surfactant for Printed Circuit Board and Stencil Cleaning Applications
This paper will discuss the technical challenges associated with the selection of chemical additive for the printed circuit board assembly (PCBA) and stencil cleaning processes. The removal of
.. read more
The Role of Permeability and Ion Transport In Conformal Coating Protection
The level of protection offered by a range of conformal coatings on electronic assemblies has been evaluated. The role of permeability and ion transport is the primary interest. Testing was car
.. read more
Process Qualification Using the IPC-B-52 Standard Test Assembly
Many professionals in the electronics manufacturing industry have,or eventually will,face the issue of determining
whether the materials of construction for printed wiring assemblies (PWAs) are
.. read more
Removal of Palladium Residue in Semi-Additive Process for Enhanced Reliability in
In order to satisfy the ever-increasing demand for smaller and lighter electronic devices,a drastic miniaturization is making
rapid progresses for even circuit features on printed wiring boards
.. read more
The Chemistry and Properties of a Newly Developed Immersion Silver Coating for PWB
To meet the emerging requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating
from hot-air-leveled SnPb solder to alternative final finishes. A thin
.. read more
Are Lead-free Assemblies Especially Endangered by Climatic Safety?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide
move toward lead-free manufacturing,has initiated a closer scrutiny towards e
.. read more
Soldering Fluxes and the Repair Process
Wave soldering fluxes are currently used in hand soldering operations as a matter of course and with little
regard for flux deposition amounts. This use has led to the investigation of fluxes u
.. read more