Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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New Phosphorus-Based Curing Agent for Copper Clad Laminates
A new organophosphorus curing agent,Fyrol PMP,specially designed for electronic thermoset resins was recently
introduced to the market. This paper describes the chemical structure and physical
.. read more
Thermally Conductive Free-Standing Dielectric Materials for Printed Circuit Boards without Halogens or Phosphorous
At the same time the electronics industry is moving towards higher power and faster clock speed,components are becoming
smaller in size and packed more densely on circuit boards. Together these
.. read more
New Lead Free Solder Composition and Physical Properties of Printed Wiring Board Laminate Material To Suppress Lift-Off and Improve Reliability
Lift-off (fillet-lifting) and land-lifting phenomena,which occur in wave soldering with Sn-Ag-Cu (SAC) solders,depend
on the physical properties of the solder and the laminate material used. A
.. read more
Environmentally Friendly Low Transmission Loss Base/Multilayer Materials
The frequencies used to communicate and process information have been extended beyond the GHz band to the microwave
band to handle the growing volume of data. Moreover,increasing global interes
.. read more
Thermal Mechanical Analysis T-260 Printed Wiring Board Testing
Evaluation of printed wiring boards (PWBs) for thermal reliability during assembly and rework operations by Thermal
Mechanical Analyzer (TMA) “T-260” testing has been an accepted practice for m
.. read more
A New Non-Halogen Flame-Retardant System for Printed Wiring Boards
There is continued interest in utilizing alternatives to bromine-based flame retardants for printed wiring boards. As a result,a
wide variety of phosphorus and non-phosphorus systems have been
.. read more
An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. Solders containing lead have
been the standard in printed circuit assembly processes. Lead-free sol
.. read more
Peroxy-Sulfuric Oxide Replacements – A Pathway to Improved Technology for Fine Line Processes
Traditional reduced black oxide processes for inner layer bonding have been superseded by a newer generation of peroxidesulfuric
texturing processes. These lower cost processes,based on an orga
.. read more
Reliability of High Density,High Layer Count,Multilayer Backplanes
This paper discusses the work and testing performed to obtain extreme high reliability performance from high layer count,
large panel format multilayer printed wiring boards that are used for b
.. read more
Comparison of High-Tg-FR-4 Base Materials
Customer demands concerning thermal stability of PCB base materials are increasing. Rising complexity of
printed circuit boards requires an improved quality of the dielectric in terms of cleanl
.. read more
New Phosphorus-Based Curing Agent for Copper Clad Laminates
A new organophosphorus curing agent,Fyrol PMP,specially designed for electronic thermoset resins was recently
introduced to the market. This paper describes the chemical structure and physical
.. read more
Thermally Conductive Free-Standing Dielectric Materials for Printed Circuit Boards without Halogens or Phosphorous
At the same time the electronics industry is moving towards higher power and faster clock speed,components are becoming
smaller in size and packed more densely on circuit boards. Together these
.. read more
New Lead Free Solder Composition and Physical Properties of Printed Wiring Board Laminate Material To Suppress Lift-Off and Improve Reliability
Lift-off (fillet-lifting) and land-lifting phenomena,which occur in wave soldering with Sn-Ag-Cu (SAC) solders,depend
on the physical properties of the solder and the laminate material used. A
.. read more
Environmentally Friendly Low Transmission Loss Base/Multilayer Materials
The frequencies used to communicate and process information have been extended beyond the GHz band to the microwave
band to handle the growing volume of data. Moreover,increasing global interes
.. read more
Thermal Mechanical Analysis T-260 Printed Wiring Board Testing
Evaluation of printed wiring boards (PWBs) for thermal reliability during assembly and rework operations by Thermal
Mechanical Analyzer (TMA) “T-260” testing has been an accepted practice for m
.. read more
A New Non-Halogen Flame-Retardant System for Printed Wiring Boards
There is continued interest in utilizing alternatives to bromine-based flame retardants for printed wiring boards. As a result,a
wide variety of phosphorus and non-phosphorus systems have been
.. read more
An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. Solders containing lead have
been the standard in printed circuit assembly processes. Lead-free sol
.. read more
Peroxy-Sulfuric Oxide Replacements – A Pathway to Improved Technology for Fine Line Processes
Traditional reduced black oxide processes for inner layer bonding have been superseded by a newer generation of peroxidesulfuric
texturing processes. These lower cost processes,based on an orga
.. read more
Reliability of High Density,High Layer Count,Multilayer Backplanes
This paper discusses the work and testing performed to obtain extreme high reliability performance from high layer count,
large panel format multilayer printed wiring boards that are used for b
.. read more
Comparison of High-Tg-FR-4 Base Materials
Customer demands concerning thermal stability of PCB base materials are increasing. Rising complexity of
printed circuit boards requires an improved quality of the dielectric in terms of cleanl
.. read more