Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Calculated Shear Stress Produced by Silicone and Epoxy Thermal Interface Materials (TIMs) During Thermal Cycling
Choosing a Thermal Interface Material adhesive can have an impact on the reliability of the microelectronic package in harsh thermal environments where thermal cycling temperature ranges are mo
.. read more
Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. read more
Ultra-Thin 3D Package Development and Qualification Testing
The motivation for developing higher density IC packaging continues to be the personal entertainment and the portable
handset markets. Consumers? expectations are that each new generation of pr
.. read more
Round-Robin,Predictor Models for T-Cycle life
Solder joints tend to crack after extended thermal cycling,if the component and the circuit board are CTE mis-matched. Predicting t-cycle lifetime is a crucial first step in optimizing product
.. read more
Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure
Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol
.. read more
Thermal Expansion of Silicones in Electronic Reliability
CTE mismatches during temperature cycling can cause significant movement of components and materials relative to one
another,which in turn stresses solder joints and wirebonds. Silicones are of
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
A DOE to assess PCB fabrication material design and process using IST (Interconnect Stress Testing) to improve fine pitch BGA...
During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer
.. read more
Via (Plated Through Hole) Integrity with Lead Free Soldering
Bare printed wiring board materials require changes from today’s typical standard dicy cured FR4 materials in order to
support lead-free assembly. The High Density Packaging User’s Group has co
.. read more
Microstructure and Properties of Sn-Pb Solder Joints with Sn-Bi Finished Components
For this study,researchers from the University of Toronto produced samples of Sn-Pb solder,with additions of bismuth,
solidified at controlled cooling rates. The microstructure of the various B
.. read more
Visual and Reliability Testing Results of Circuit Boards Assembled with Lead Free Components,Soldering Materials and Processes in a Simulated Production...
The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the
electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S
.. read more
Lead Free Implementation - A Case Study Correlating the Thermal Profile and Laboratory Analysis
The electronic industry has been migrating to lead-free solder alloys by legislation forces. In Europe the WEEE/RoHS are
scheduled to ban Pb alloys in July 2006. China is in process of preparin
.. read more
JCAA/JG-PP No-Lead Solder Project: -20°C to +80°C Thermal Cycle Test
Thermal cycle testing is being conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint
Group on Pollution Prevention (JCAA/JG-PP) No-Lead Solder Project. The J
.. read more
Higher Reliability “Oriented” Plastic Packages
Plastic IC Packages are generally considered to be not as reliable as their ceramic counterparts. One of the major reasons is
the question of hermeticity. Plastic materials generally allow mois
.. read more
Design of Experiment in Micro-Via Thermal Fatigue Test
The objectives of the present study are to design,fabricate,and test various configurations of micro-vias over military
thermal environment,and then evaluate the impacts of micro-via design/man
.. read more
Tin Whisker Growth - Substrate Effect Understanding CTE Mismatch and IMC Formation
The hypothesis that the “whisker growth phenomenon” in electrodeposited tin is a re-crystallization process driven by stress
has gained popularity among leading research institutes and industri
.. read more
Assembly,Rework and Reliability of Lead-free FCBGA Soldered Component
Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has
passed legislation requiring the removal of lead from electronics assembly b
.. read more
Finite Element Analysis of Flip Chip Ball Grid Array Packages for BGA Life Prediction: 2D,3D or Axisymmetric?
A variety of mechanical and thermal stress related problems related to Flip Chip Ball Grid Array Packages (FCBGAs) are
often solved by the Finite Element Method. Often,the question for the stre
.. read more
Use of Underfill to Enhance the Thermal Cycling Reliability of Small BGAs
In this work,we have evaluated the use of underfill to enhance the reliability of small BGAs in the automotive
thermal cycling environment. Best parameters for underfilling of BGAs were develop
.. read more
Study of Assembly Processes for Solder Flip Chips on FR-4 Substrates
Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip
interconnection types including anisotropic conductive film or
.. read more
BGA Mounting Using Improved Solder Columns
BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the
BGAs,which results in a TCE Mismatch between the components. If such an assembl
.. read more
Calculated Shear Stress Produced by Silicone and Epoxy Thermal Interface Materials (TIMs) During Thermal Cycling
Choosing a Thermal Interface Material adhesive can have an impact on the reliability of the microelectronic package in harsh thermal environments where thermal cycling temperature ranges are mo
.. read more
Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. read more
Ultra-Thin 3D Package Development and Qualification Testing
The motivation for developing higher density IC packaging continues to be the personal entertainment and the portable
handset markets. Consumers? expectations are that each new generation of pr
.. read more
Round-Robin,Predictor Models for T-Cycle life
Solder joints tend to crack after extended thermal cycling,if the component and the circuit board are CTE mis-matched. Predicting t-cycle lifetime is a crucial first step in optimizing product
.. read more
Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure
Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol
.. read more
Thermal Expansion of Silicones in Electronic Reliability
CTE mismatches during temperature cycling can cause significant movement of components and materials relative to one
another,which in turn stresses solder joints and wirebonds. Silicones are of
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
A DOE to assess PCB fabrication material design and process using IST (Interconnect Stress Testing) to improve fine pitch BGA...
During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer
.. read more
Via (Plated Through Hole) Integrity with Lead Free Soldering
Bare printed wiring board materials require changes from today’s typical standard dicy cured FR4 materials in order to
support lead-free assembly. The High Density Packaging User’s Group has co
.. read more
Microstructure and Properties of Sn-Pb Solder Joints with Sn-Bi Finished Components
For this study,researchers from the University of Toronto produced samples of Sn-Pb solder,with additions of bismuth,
solidified at controlled cooling rates. The microstructure of the various B
.. read more
Visual and Reliability Testing Results of Circuit Boards Assembled with Lead Free Components,Soldering Materials and Processes in a Simulated Production...
The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the
electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S
.. read more
Lead Free Implementation - A Case Study Correlating the Thermal Profile and Laboratory Analysis
The electronic industry has been migrating to lead-free solder alloys by legislation forces. In Europe the WEEE/RoHS are
scheduled to ban Pb alloys in July 2006. China is in process of preparin
.. read more
JCAA/JG-PP No-Lead Solder Project: -20°C to +80°C Thermal Cycle Test
Thermal cycle testing is being conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint
Group on Pollution Prevention (JCAA/JG-PP) No-Lead Solder Project. The J
.. read more
Higher Reliability “Oriented” Plastic Packages
Plastic IC Packages are generally considered to be not as reliable as their ceramic counterparts. One of the major reasons is
the question of hermeticity. Plastic materials generally allow mois
.. read more
Design of Experiment in Micro-Via Thermal Fatigue Test
The objectives of the present study are to design,fabricate,and test various configurations of micro-vias over military
thermal environment,and then evaluate the impacts of micro-via design/man
.. read more
Tin Whisker Growth - Substrate Effect Understanding CTE Mismatch and IMC Formation
The hypothesis that the “whisker growth phenomenon” in electrodeposited tin is a re-crystallization process driven by stress
has gained popularity among leading research institutes and industri
.. read more
Assembly,Rework and Reliability of Lead-free FCBGA Soldered Component
Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has
passed legislation requiring the removal of lead from electronics assembly b
.. read more
Finite Element Analysis of Flip Chip Ball Grid Array Packages for BGA Life Prediction: 2D,3D or Axisymmetric?
A variety of mechanical and thermal stress related problems related to Flip Chip Ball Grid Array Packages (FCBGAs) are
often solved by the Finite Element Method. Often,the question for the stre
.. read more
Use of Underfill to Enhance the Thermal Cycling Reliability of Small BGAs
In this work,we have evaluated the use of underfill to enhance the reliability of small BGAs in the automotive
thermal cycling environment. Best parameters for underfilling of BGAs were develop
.. read more
Study of Assembly Processes for Solder Flip Chips on FR-4 Substrates
Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip
interconnection types including anisotropic conductive film or
.. read more
BGA Mounting Using Improved Solder Columns
BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the
BGAs,which results in a TCE Mismatch between the components. If such an assembl
.. read more