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Novel,VOC-Compliant Aqueous Cleaning Agents for Post-Solder Defluxing
To meet today’s environmental demands,new VOC-free and low-VOC cleaning agents have been formulated that exhibit
outstanding cleaning performance for a variety of flux residues. The new cleanin
.. read more
HDPUG's Reliability Testing and Data Analysis of High-Density Packages Lead-Free Solder Joints
Temperature cycling test and statistical analysis of various high-density packages on PCBs with SnCu HASL,NiAu,
and OSP finishes are investigated in this study. Emphasis is placed on the determ
.. read more
Board Finish Solderability with Sn-Ag-Cu
Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the
industry. It is expected that soldering in a nitrogen atmosphere might over
.. read more
Preliminary Study on Lead-free Sn42Bi57Ag1 Solder Paste
With the growth of the concern on the environment,more and more efforts have been done to protect the earth,to
minimize the pollution on the environment. The use of the lead free solder is repl
.. read more
Electroplating and Properties of Lead-Free Finishes
Tin alloys such as Sn 0.7% Cu and Sn 2%Bi were identified as a viable alternative to tin-lead finish. Electroplating
of these alloys is challenging because of great difference in reduction pote
.. read more
Investigating Mass Imaging Lead Free Materials Using Enclosed Print Head Technology
Within the Surface Mount Assembly (S.M.A.) process,solder paste is primarily used as a mechanical and electrical
connection. Solder paste is generally deposited using a mass imaging process,suc
.. read more
Novel,VOC-Compliant Aqueous Cleaning Agents for Post-Solder Defluxing
To meet today’s environmental demands,new VOC-free and low-VOC cleaning agents have been formulated that exhibit
outstanding cleaning performance for a variety of flux residues. The new cleanin
.. read more
HDPUG's Reliability Testing and Data Analysis of High-Density Packages Lead-Free Solder Joints
Temperature cycling test and statistical analysis of various high-density packages on PCBs with SnCu HASL,NiAu,
and OSP finishes are investigated in this study. Emphasis is placed on the determ
.. read more
Board Finish Solderability with Sn-Ag-Cu
Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the
industry. It is expected that soldering in a nitrogen atmosphere might over
.. read more
Preliminary Study on Lead-free Sn42Bi57Ag1 Solder Paste
With the growth of the concern on the environment,more and more efforts have been done to protect the earth,to
minimize the pollution on the environment. The use of the lead free solder is repl
.. read more
Electroplating and Properties of Lead-Free Finishes
Tin alloys such as Sn 0.7% Cu and Sn 2%Bi were identified as a viable alternative to tin-lead finish. Electroplating
of these alloys is challenging because of great difference in reduction pote
.. read more
Investigating Mass Imaging Lead Free Materials Using Enclosed Print Head Technology
Within the Surface Mount Assembly (S.M.A.) process,solder paste is primarily used as a mechanical and electrical
connection. Solder paste is generally deposited using a mass imaging process,suc
.. read more