Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Hot Air Solder Leveling in the Lead-free Era
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized,in the years leading up to the implementa
.. read more
Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies
The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability
.. read more
Creep Corrosion of PWB Final Finishes: Its Cause and Prevention
As the electronic industry moves to lead-free assembly and finer-pitch circuits,widely used printed wiring board (PWB) finish,SnPb HASL,has been replaced with lead-free and coplanar PWB finishe
.. read more
Rework Process Window and Microstructural Analysis for Lead-Free Mirrored Bga Design Points
Hot gas rework of BGAs with a mirrored BGA design configuration using SnAgCu based lead-free alloys is more challenging as compared to conventional SnPb techniques. Rework of BGAs using a conve
.. read more
A Study on Copper Dissolution in Liquid Lead Free Solders under Static and Dynamic Conditions
During lead-free wave soldering or rework operation for through hole components,high rate copper dissolution may occur to printed wiring boards. It is widely believed that Sn-Ag-Cu (SAC) lead-f
.. read more
The Effect of Copper Plating Processes and Chemistries on Copper Dissolution
Implementation of lead-free assembly processes results in higher copper dissolution rate than traditional SnPb alloys. The rate at which copper is dissolved could be dependent on many factors,s
.. read more
A Test Methodology for Copper Dissolution in Lead-Free Alloys
Lead-free selective soldering can result in extended times at high temperatures,which in turn can result in excessive dissolution of exposed copper,such as plated through holes. This phenomenon
.. read more
Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates
The high temperature exposures associated with lead-free soldering of printed circuit boards (PCBs) can alter the laminate
material properties thereby creating a shift in the performance and re
.. read more
Pb-Free Reflow,PCB Degradation,and the Influence of Moisture Absorption
The cracking and delamination of printed circuit boards (PCB) during exposure to elevated thermal exposure,such as reflow and rework,have always been a concern for the electronics industry. How
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since July 1st 2006,the 2002/95/EC RoHS European directive has forced the electronic industry to switch from Tin-Lead to lead-free soldering alloys for components assembly.
Exemption domains ha
.. read more
Lead-free Feasibility Program: Assembly and Testing of a Functional Military Avionics Unit
Although the official implementation of the EU Restriction of Hazardous Substances (RoHS) directive officially started on July 1,2006,a significant portion of the avionics electronics supply ch
.. read more
1st Order Failure Model for Area Array CSP Devices with Pb-Free Solder
As some of the reliability issues and cost associated with tin silver copper solders become more apparent,alternative pb-free solder formulations are being considered. Of particular interest ar
.. read more
A Study of 0201’s and Tombstoning in Lead-Free Systems,Phase II Comparison of Final Finishes and Solder Paste Formulations
Tombstoning,the phenomena where a chip component stands up on one end during the reflow cycle,is well-documented and understood in tin-lead systems. It is reported to occur more frequently in l
.. read more
Effect of Design Variables on the Reliability of Lead Free Area Array Connectors
As the use of area array connectors has become more widespread in electronic assemblies,the need to evaluate their reliability has increased. There is,however,limited information on how best to
.. read more
Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components
This paper reports the results of an evaluation of tin mitigation processes for components,i.e. converting parts with pure tin (Sn) and other lead-free (Pb-free) finishes to tin-lead (SnPb) fin
.. read more
Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure
Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol
.. read more
Properties that are Important in Lead-Free Solders
The change to lead-free solders has forced the electronics industry to consider more than it ever has before what properties are important in a solder. When the tin-lead eutectic was the only s
.. read more
A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability
Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature,
.. read more
Effect of Contact Time on Lead-Free Wave Soldering
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics
.. read more
"Behind the Scenes" of Effective OSP Protection in Pb-free Processing
Advancements and evolutions in printed circuit board manufacturing,design,and electronics assembly have driven new research on high temperature organic solderability preservative (HT OSP) surfa
.. read more
Implementation of Flip-Chip and Chip-Size Package Technology
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
Process Development with Temperature Sensitive Components in Server Applications
As the electronics industry prepares for the possibility of Pb-free Printed Circuit Board Assembly (PCBA) processing without the EU RoHS server Pb solder exemption,many studies continue to focu
.. read more
Process and Assembly Methods for Increased Yield of Package on Package Devices
Increased functionality and smaller devices are significant drivers in innovative packaging designs. One of the newer package types to be introduced into the market place in the past few years
.. read more
Engineered Cleaning Fluids Designed for Batch Processing
Highly dense circuit assemblies increase the cleaning challenge. Batch cleaning equipment designs provide a small footprint,low cleaning fluid consumption,and low cost of ownership. Batch clean
.. read more
Methods for Choosing a Saponifier or Surfactant for Printed Circuit Board and Stencil Cleaning Applications
This paper will discuss the technical challenges associated with the selection of chemical additive for the printed circuit board assembly (PCBA) and stencil cleaning processes. The removal of
.. read more
Broadband Printing – A Paradigm
The SMT industry is going through a challenging phase of assembling miniature components,such as micro BGA,0.3mm CSP and 01005 passives onto Printed Circuit Boards (PCB). This effort is primari
.. read more
Design for Manufacturability in the Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. read more
QFN Rework Challenges in a Lead Free World IPC Midwest - Sept. 2007
It is clear that the future belongs to the ever shrinking component. Micro Lead Frame (MLF) components,and specifically the Quad Flat No-lead (QFN) packages have gained wide scale acceptance.
.. read more
Hot Air Solder Leveling in the Lead-free Era
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized,in the years leading up to the implementa
.. read more
Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies
The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability
.. read more
Creep Corrosion of PWB Final Finishes: Its Cause and Prevention
As the electronic industry moves to lead-free assembly and finer-pitch circuits,widely used printed wiring board (PWB) finish,SnPb HASL,has been replaced with lead-free and coplanar PWB finishe
.. read more
Rework Process Window and Microstructural Analysis for Lead-Free Mirrored Bga Design Points
Hot gas rework of BGAs with a mirrored BGA design configuration using SnAgCu based lead-free alloys is more challenging as compared to conventional SnPb techniques. Rework of BGAs using a conve
.. read more
A Study on Copper Dissolution in Liquid Lead Free Solders under Static and Dynamic Conditions
During lead-free wave soldering or rework operation for through hole components,high rate copper dissolution may occur to printed wiring boards. It is widely believed that Sn-Ag-Cu (SAC) lead-f
.. read more
The Effect of Copper Plating Processes and Chemistries on Copper Dissolution
Implementation of lead-free assembly processes results in higher copper dissolution rate than traditional SnPb alloys. The rate at which copper is dissolved could be dependent on many factors,s
.. read more
A Test Methodology for Copper Dissolution in Lead-Free Alloys
Lead-free selective soldering can result in extended times at high temperatures,which in turn can result in excessive dissolution of exposed copper,such as plated through holes. This phenomenon
.. read more
Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates
The high temperature exposures associated with lead-free soldering of printed circuit boards (PCBs) can alter the laminate
material properties thereby creating a shift in the performance and re
.. read more
Pb-Free Reflow,PCB Degradation,and the Influence of Moisture Absorption
The cracking and delamination of printed circuit boards (PCB) during exposure to elevated thermal exposure,such as reflow and rework,have always been a concern for the electronics industry. How
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since July 1st 2006,the 2002/95/EC RoHS European directive has forced the electronic industry to switch from Tin-Lead to lead-free soldering alloys for components assembly.
Exemption domains ha
.. read more
Lead-free Feasibility Program: Assembly and Testing of a Functional Military Avionics Unit
Although the official implementation of the EU Restriction of Hazardous Substances (RoHS) directive officially started on July 1,2006,a significant portion of the avionics electronics supply ch
.. read more
1st Order Failure Model for Area Array CSP Devices with Pb-Free Solder
As some of the reliability issues and cost associated with tin silver copper solders become more apparent,alternative pb-free solder formulations are being considered. Of particular interest ar
.. read more
A Study of 0201’s and Tombstoning in Lead-Free Systems,Phase II Comparison of Final Finishes and Solder Paste Formulations
Tombstoning,the phenomena where a chip component stands up on one end during the reflow cycle,is well-documented and understood in tin-lead systems. It is reported to occur more frequently in l
.. read more
Effect of Design Variables on the Reliability of Lead Free Area Array Connectors
As the use of area array connectors has become more widespread in electronic assemblies,the need to evaluate their reliability has increased. There is,however,limited information on how best to
.. read more
Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components
This paper reports the results of an evaluation of tin mitigation processes for components,i.e. converting parts with pure tin (Sn) and other lead-free (Pb-free) finishes to tin-lead (SnPb) fin
.. read more
Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure
Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol
.. read more
Properties that are Important in Lead-Free Solders
The change to lead-free solders has forced the electronics industry to consider more than it ever has before what properties are important in a solder. When the tin-lead eutectic was the only s
.. read more
A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability
Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature,
.. read more
Effect of Contact Time on Lead-Free Wave Soldering
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics
.. read more
"Behind the Scenes" of Effective OSP Protection in Pb-free Processing
Advancements and evolutions in printed circuit board manufacturing,design,and electronics assembly have driven new research on high temperature organic solderability preservative (HT OSP) surfa
.. read more
Implementation of Flip-Chip and Chip-Size Package Technology
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
Process Development with Temperature Sensitive Components in Server Applications
As the electronics industry prepares for the possibility of Pb-free Printed Circuit Board Assembly (PCBA) processing without the EU RoHS server Pb solder exemption,many studies continue to focu
.. read more
Process and Assembly Methods for Increased Yield of Package on Package Devices
Increased functionality and smaller devices are significant drivers in innovative packaging designs. One of the newer package types to be introduced into the market place in the past few years
.. read more
Engineered Cleaning Fluids Designed for Batch Processing
Highly dense circuit assemblies increase the cleaning challenge. Batch cleaning equipment designs provide a small footprint,low cleaning fluid consumption,and low cost of ownership. Batch clean
.. read more
Methods for Choosing a Saponifier or Surfactant for Printed Circuit Board and Stencil Cleaning Applications
This paper will discuss the technical challenges associated with the selection of chemical additive for the printed circuit board assembly (PCBA) and stencil cleaning processes. The removal of
.. read more
Broadband Printing – A Paradigm
The SMT industry is going through a challenging phase of assembling miniature components,such as micro BGA,0.3mm CSP and 01005 passives onto Printed Circuit Boards (PCB). This effort is primari
.. read more
Design for Manufacturability in the Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. read more
QFN Rework Challenges in a Lead Free World IPC Midwest - Sept. 2007
It is clear that the future belongs to the ever shrinking component. Micro Lead Frame (MLF) components,and specifically the Quad Flat No-lead (QFN) packages have gained wide scale acceptance.
.. read more