Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Creep Corrosion of PWB Final Finishes: Its Cause and Prevention
As the electronic industry moves to lead-free assembly and finer-pitch circuits,widely used printed wiring board (PWB) finish,SnPb HASL,has been replaced with lead-free and coplanar PWB finishe
.. read more
Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies
The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability
.. read more
Rework Process Window and Microstructural Analysis for Lead-Free Mirrored Bga Design Points
Hot gas rework of BGAs with a mirrored BGA design configuration using SnAgCu based lead-free alloys is more challenging as compared to conventional SnPb techniques. Rework of BGAs using a conve
.. read more
A Study on Copper Dissolution in Liquid Lead Free Solders under Static and Dynamic Conditions
During lead-free wave soldering or rework operation for through hole components,high rate copper dissolution may occur to printed wiring boards. It is widely believed that Sn-Ag-Cu (SAC) lead-f
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since July 1st 2006,the 2002/95/EC RoHS European directive has forced the electronic industry to switch from Tin-Lead to lead-free soldering alloys for components assembly.
Exemption domains ha
.. read more
Lead-free Feasibility Program: Assembly and Testing of a Functional Military Avionics Unit
Although the official implementation of the EU Restriction of Hazardous Substances (RoHS) directive officially started on July 1,2006,a significant portion of the avionics electronics supply ch
.. read more
A Study of 0201’s and Tombstoning in Lead-Free Systems,Phase II Comparison of Final Finishes and Solder Paste Formulations
Tombstoning,the phenomena where a chip component stands up on one end during the reflow cycle,is well-documented and understood in tin-lead systems. It is reported to occur more frequently in l
.. read more
Properties that are Important in Lead-Free Solders
The change to lead-free solders has forced the electronics industry to consider more than it ever has before what properties are important in a solder. When the tin-lead eutectic was the only s
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature,
.. read more
"Behind the Scenes" of Effective OSP Protection in Pb-free Processing
Advancements and evolutions in printed circuit board manufacturing,design,and electronics assembly have driven new research on high temperature organic solderability preservative (HT OSP) surfa
.. read more
Performing Flux-Technology for Pb-Free SN100C Solders
SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol
.. read more
Effect of Design Variables on the Reliability of Lead Free Area Array Connectors
As the use of area array connectors has become more widespread in electronic assemblies,the need to evaluate their reliability has increased. There is,however,limited information on how best to
.. read more
A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability
Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f
.. read more
Effect of Contact Time on Lead-Free Wave Soldering
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics
.. read more
Broadband Printing – A Paradigm
The SMT industry is going through a challenging phase of assembling miniature components,such as micro BGA,0.3mm CSP and 01005 passives onto Printed Circuit Boards (PCB). This effort is primari
.. read more
Reflow Process Control Monitoring,and Data Logging
With the introduction of lead free electronics assembly worldwide,greater concerns are raised over factory control of materials and processes. Due to the mix of both leaded and lead free produc
.. read more
Liquid Tin Corrosion and Lead Free Wave Soldering
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The l
.. read more
Effect of OSP Chemistry on the Hole Fill Performance During Pb-free Wave Soldering
This paper analyzes the differences in plated through hole fill performance between the regular OSP and Pb-free OSP PCB surface finish chemistries in a Pb-free wave solder process. The variable
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Describing Key Coating and Process Characteristics of a Pb-Free OSP Process
Organic Solderability Preservatives (OSP) continue to attract significant attention as circuit board final finishes. They have evolved from simple and thin benzotriazole coatings to thicker and
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more
Reflow Defects with Lead-Free Soldering Moisture Sensitive Components
Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav
.. read more
Lead Free Processing and other Thermal Challenges for Flexible Printed Circuits
In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric
.. read more
Durability of Repaired and Aged Lead-free Electronic Assemblies
The reliability of aged and repaired lead-free and mixed lead-free/lead-based solder interconnects is an important issue for electronic equipment manufacturers. As a result of the global transi
.. read more
Lead Free Assembly Qualification of ALIVH Boards
The migration to lead free reflow is bringing many challenges for the PCB industry. High Tg laminates,stability of materials thru 2X reflows,rework,moisture sensitivity etc. This requires caref
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
Durability of Repaired and Aged Lead-free Electronic Assemblies
The reliability of aged and repaired lead-free and mixed lead-free/lead-based solder interconnects is an important issue for electronic equipment manufacturers. As a result of the global transi
.. read more
Large and Thick Board Lead-Free Wave Soldering Optimization
This paper presents the results of our study on the development and optimization of lead-free wave soldering process for large and thick printed circuit boards (PCB),through multiple designs of
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more
Creep Corrosion of PWB Final Finishes: Its Cause and Prevention
As the electronic industry moves to lead-free assembly and finer-pitch circuits,widely used printed wiring board (PWB) finish,SnPb HASL,has been replaced with lead-free and coplanar PWB finishe
.. read more
Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies
The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability
.. read more
Rework Process Window and Microstructural Analysis for Lead-Free Mirrored Bga Design Points
Hot gas rework of BGAs with a mirrored BGA design configuration using SnAgCu based lead-free alloys is more challenging as compared to conventional SnPb techniques. Rework of BGAs using a conve
.. read more
A Study on Copper Dissolution in Liquid Lead Free Solders under Static and Dynamic Conditions
During lead-free wave soldering or rework operation for through hole components,high rate copper dissolution may occur to printed wiring boards. It is widely believed that Sn-Ag-Cu (SAC) lead-f
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since July 1st 2006,the 2002/95/EC RoHS European directive has forced the electronic industry to switch from Tin-Lead to lead-free soldering alloys for components assembly.
Exemption domains ha
.. read more
Lead-free Feasibility Program: Assembly and Testing of a Functional Military Avionics Unit
Although the official implementation of the EU Restriction of Hazardous Substances (RoHS) directive officially started on July 1,2006,a significant portion of the avionics electronics supply ch
.. read more
A Study of 0201’s and Tombstoning in Lead-Free Systems,Phase II Comparison of Final Finishes and Solder Paste Formulations
Tombstoning,the phenomena where a chip component stands up on one end during the reflow cycle,is well-documented and understood in tin-lead systems. It is reported to occur more frequently in l
.. read more
Properties that are Important in Lead-Free Solders
The change to lead-free solders has forced the electronics industry to consider more than it ever has before what properties are important in a solder. When the tin-lead eutectic was the only s
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature,
.. read more
"Behind the Scenes" of Effective OSP Protection in Pb-free Processing
Advancements and evolutions in printed circuit board manufacturing,design,and electronics assembly have driven new research on high temperature organic solderability preservative (HT OSP) surfa
.. read more
Performing Flux-Technology for Pb-Free SN100C Solders
SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol
.. read more
Effect of Design Variables on the Reliability of Lead Free Area Array Connectors
As the use of area array connectors has become more widespread in electronic assemblies,the need to evaluate their reliability has increased. There is,however,limited information on how best to
.. read more
A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability
Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f
.. read more
Effect of Contact Time on Lead-Free Wave Soldering
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics
.. read more
Broadband Printing – A Paradigm
The SMT industry is going through a challenging phase of assembling miniature components,such as micro BGA,0.3mm CSP and 01005 passives onto Printed Circuit Boards (PCB). This effort is primari
.. read more
Reflow Process Control Monitoring,and Data Logging
With the introduction of lead free electronics assembly worldwide,greater concerns are raised over factory control of materials and processes. Due to the mix of both leaded and lead free produc
.. read more
Liquid Tin Corrosion and Lead Free Wave Soldering
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The l
.. read more
Effect of OSP Chemistry on the Hole Fill Performance During Pb-free Wave Soldering
This paper analyzes the differences in plated through hole fill performance between the regular OSP and Pb-free OSP PCB surface finish chemistries in a Pb-free wave solder process. The variable
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Describing Key Coating and Process Characteristics of a Pb-Free OSP Process
Organic Solderability Preservatives (OSP) continue to attract significant attention as circuit board final finishes. They have evolved from simple and thin benzotriazole coatings to thicker and
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more
Reflow Defects with Lead-Free Soldering Moisture Sensitive Components
Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav
.. read more
Lead Free Processing and other Thermal Challenges for Flexible Printed Circuits
In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric
.. read more
Durability of Repaired and Aged Lead-free Electronic Assemblies
The reliability of aged and repaired lead-free and mixed lead-free/lead-based solder interconnects is an important issue for electronic equipment manufacturers. As a result of the global transi
.. read more
Lead Free Assembly Qualification of ALIVH Boards
The migration to lead free reflow is bringing many challenges for the PCB industry. High Tg laminates,stability of materials thru 2X reflows,rework,moisture sensitivity etc. This requires caref
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
Durability of Repaired and Aged Lead-free Electronic Assemblies
The reliability of aged and repaired lead-free and mixed lead-free/lead-based solder interconnects is an important issue for electronic equipment manufacturers. As a result of the global transi
.. read more
Large and Thick Board Lead-Free Wave Soldering Optimization
This paper presents the results of our study on the development and optimization of lead-free wave soldering process for large and thick printed circuit boards (PCB),through multiple designs of
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more