Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Aerospace Response to Lead-free Solder - A Program Manager’s Guide
On July 1,2006,lead and certain other hazardous materials were banned from most forms of new electronic equipment in the countries of the European Union. Although most aerospace products are no
.. read more
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more
Experience in Processing EEE Components with Pure Electroplated Tin Leads As a
The regulatory measures defined in MIL performance standards that govern production of active and passive electronic components ban the application of pure Sn plated leads for EEE parts. The st
.. read more
New Methods to Efficiently Test the Reliability of Plated Vias and to Model Plated Via Life from Laminate Material Data
This paper continues work by Sun Microsystems and the University of Maryland,CALCE[1] to predict plated through via life using laminate material properties,plated copper material properties,and
.. read more
A Symphony of Synergy: How Certification to the IECQ HSPM Specification
The IPC's Lead Free program addresses one of the 6 Hazardous Substances regulated by the RoHS directive. Certification to the QC 080000,the IECQ HSPM Specification,addresses the other 5 Hazardo
.. read more
Lead Free Assembly Impacts on Laminate Material Properties and “Pad Crater” Failures
Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress
.. read more
A DOE to assess PCB fabrication material design and process using IST (Interconnect Stress Testing) to improve fine pitch BGA...
During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer
.. read more
Hybrid Drying Technology for In-line Aqueous
boards in the in-line aqueous cleaning process. As lead-free circuit boards become more complex and component spacing
decreases,the effectiveness of direct blow-off drying is greatly diminished
.. read more
A STUDY OF PLANAR MICROVOIDING IN Pb-FREE SOLDER JOINTS
Planar microvoids have been observed on second level interconnections between solder metallizations and copper lands on PCB boards with immersion silver surface finish. These planar microvoids
.. read more
Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing
For some years now,an area ratio of 0.66 or greater has been the criterion for stencil apertures to achieve acceptable volume control in the printed solder paste “brick,” for small apertures Me
.. read more
Critical Cleaning of Highly Densed Electronic Assemblies in the Lead Free
An important development in high reliability electronics is the convergence of circuit board and advanced packaging technologies. This combination enhances the best attributes of each technolog
.. read more
Corrosion Resistance of PWB Final Finishes
As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi
.. read more
Development of Lead Free Paste for Small Reflow Ovens
Today,there exists a major push towards lead free soldering in the international electronics industry. It has presented a
number of challenges in both the surface mount and wave soldering proce
.. read more
Achieving Sn/Pb Void Performance Utilizing Lead Free Solder Pastes
One of the reported problems in moving to lead free has been increased solder voiding. Current research indicates that paste
formulation,reflow profile and board finish,when selected carefully,
.. read more
JCAA/JG-PP Lead Free Solder Project: Combined Solder Project: Combined Environments Test
A combined environment testing was conducted for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention
Lead free Solder project. The purpose of the project was to validate and
.. read more
Visual and Reliability Testing Results of Circuit Boards Assembled with Lead Free Components,Soldering Materials and Processes in a Simulated Production...
The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the
electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S
.. read more
Analysis of AXI Test on Fine Pitch Components between Lead Free and Tin/Lead Assembly
By now,most people in the industry understand how complex it is to convert a factory from using a Tin-Lead (Eutectic)
Solder process to a Lead Free process. The implementation of this change re
.. read more
Effect of Surface Finish,Reflow Profile and High Temperature Aging on Drop Test Reliability of Lead Free CSPs
Chip scale packages (CSPs) are widely used in portable electronic products. Mechanical drop testing is a critical reliability
requirement for these products. With the switch to lead free solder
.. read more
Reliability Tests of Lead Free Solder Joints
Reliability of RoHS compliant products is investigated in this study. Emphasis is placed on the lead free solder joint
reliability. Solder is the electrical and mechanical “glue” of electronics
.. read more
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. read more
Cleaning Lead Free prior to Conformal Coating? Risks and Implications
Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the
soldering steps significantly impair the cross linkage and can be sa
.. read more
A Comparison of Lead Free Solder Assembly Defluxing Processes
The enactment of the Restriction of Hazardous Substances (RoHS) Directive is prompting significant changes in solder paste
formulations and their process conditions as manufacturers move to Lea
.. read more
Low Cost Lead Free Solution Evaluation for Electronic Consumer Applications
Lead products are no longer an option if you want to export to the EU market. RoHS regulations requiring the manufacture of
lead-free electronic products by July 2006 are pushing the industry t
.. read more
The Use of SAC Solder and Pb-Free Lead Materials in the Repair Scenario
Much work has been done involving the introduction of RoHS and WEEE Directives across the European Union and the
world. Although the use of Pb is limited in new products and equipment,older Pb-
.. read more
PCB Materials Behaviours towards Humidity and Impact of the Design,Finishes,Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability
As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and
process controls but also risks knowledge. To overcome humidity issue,par
.. read more
Lead Free Process Transition Solder Paste Characteristic Assessment
The migration to Lead Free raw materials in the Electronics Industry will happen faster than the date proposed in the original
draft of the legislation. A true Pb-free solution for product such
.. read more
The Study,Measurement,and Prevention of Tarnish on Immersion Silver Board Finishes
With increased environmental legislation against lead in the electronics industry1,circuit board manufacturers are
expecting chemical suppliers to formulate lead free alternatives with the same
.. read more
Avoiding the Solder Void
Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the
total void content is minimal. X-ray methods are the predominate method for so
.. read more
Equipment Impacts of Lead Free Wave Soldering
The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today’s
Wave Solder systems. Users are experiencing higher maintenance frequency and re
.. read more
Formation and Growth of Intermetallics at the Interface between Lead-free Solders and Copper Substrates
Intermetallic formation and growth were studied for the alloys Sn-3.2Ag-0.8Cu,Sn-3.5Ag,Sn-0.7Cu,and Sn-9Zn.
Coupons of solder joints (prepared by melting some of each solder alloy on a copper-p
.. read more
Aerospace Response to Lead-free Solder - A Program Manager’s Guide
On July 1,2006,lead and certain other hazardous materials were banned from most forms of new electronic equipment in the countries of the European Union. Although most aerospace products are no
.. read more
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more
Experience in Processing EEE Components with Pure Electroplated Tin Leads As a
The regulatory measures defined in MIL performance standards that govern production of active and passive electronic components ban the application of pure Sn plated leads for EEE parts. The st
.. read more
New Methods to Efficiently Test the Reliability of Plated Vias and to Model Plated Via Life from Laminate Material Data
This paper continues work by Sun Microsystems and the University of Maryland,CALCE[1] to predict plated through via life using laminate material properties,plated copper material properties,and
.. read more
A Symphony of Synergy: How Certification to the IECQ HSPM Specification
The IPC's Lead Free program addresses one of the 6 Hazardous Substances regulated by the RoHS directive. Certification to the QC 080000,the IECQ HSPM Specification,addresses the other 5 Hazardo
.. read more
Lead Free Assembly Impacts on Laminate Material Properties and “Pad Crater” Failures
Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress
.. read more
A DOE to assess PCB fabrication material design and process using IST (Interconnect Stress Testing) to improve fine pitch BGA...
During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer
.. read more
Hybrid Drying Technology for In-line Aqueous
boards in the in-line aqueous cleaning process. As lead-free circuit boards become more complex and component spacing
decreases,the effectiveness of direct blow-off drying is greatly diminished
.. read more
A STUDY OF PLANAR MICROVOIDING IN Pb-FREE SOLDER JOINTS
Planar microvoids have been observed on second level interconnections between solder metallizations and copper lands on PCB boards with immersion silver surface finish. These planar microvoids
.. read more
Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing
For some years now,an area ratio of 0.66 or greater has been the criterion for stencil apertures to achieve acceptable volume control in the printed solder paste “brick,” for small apertures Me
.. read more
Critical Cleaning of Highly Densed Electronic Assemblies in the Lead Free
An important development in high reliability electronics is the convergence of circuit board and advanced packaging technologies. This combination enhances the best attributes of each technolog
.. read more
Corrosion Resistance of PWB Final Finishes
As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi
.. read more
Development of Lead Free Paste for Small Reflow Ovens
Today,there exists a major push towards lead free soldering in the international electronics industry. It has presented a
number of challenges in both the surface mount and wave soldering proce
.. read more
Achieving Sn/Pb Void Performance Utilizing Lead Free Solder Pastes
One of the reported problems in moving to lead free has been increased solder voiding. Current research indicates that paste
formulation,reflow profile and board finish,when selected carefully,
.. read more
JCAA/JG-PP Lead Free Solder Project: Combined Solder Project: Combined Environments Test
A combined environment testing was conducted for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention
Lead free Solder project. The purpose of the project was to validate and
.. read more
Visual and Reliability Testing Results of Circuit Boards Assembled with Lead Free Components,Soldering Materials and Processes in a Simulated Production...
The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the
electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S
.. read more
Analysis of AXI Test on Fine Pitch Components between Lead Free and Tin/Lead Assembly
By now,most people in the industry understand how complex it is to convert a factory from using a Tin-Lead (Eutectic)
Solder process to a Lead Free process. The implementation of this change re
.. read more
Effect of Surface Finish,Reflow Profile and High Temperature Aging on Drop Test Reliability of Lead Free CSPs
Chip scale packages (CSPs) are widely used in portable electronic products. Mechanical drop testing is a critical reliability
requirement for these products. With the switch to lead free solder
.. read more
Reliability Tests of Lead Free Solder Joints
Reliability of RoHS compliant products is investigated in this study. Emphasis is placed on the lead free solder joint
reliability. Solder is the electrical and mechanical “glue” of electronics
.. read more
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. read more
Cleaning Lead Free prior to Conformal Coating? Risks and Implications
Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the
soldering steps significantly impair the cross linkage and can be sa
.. read more
A Comparison of Lead Free Solder Assembly Defluxing Processes
The enactment of the Restriction of Hazardous Substances (RoHS) Directive is prompting significant changes in solder paste
formulations and their process conditions as manufacturers move to Lea
.. read more
Low Cost Lead Free Solution Evaluation for Electronic Consumer Applications
Lead products are no longer an option if you want to export to the EU market. RoHS regulations requiring the manufacture of
lead-free electronic products by July 2006 are pushing the industry t
.. read more
The Use of SAC Solder and Pb-Free Lead Materials in the Repair Scenario
Much work has been done involving the introduction of RoHS and WEEE Directives across the European Union and the
world. Although the use of Pb is limited in new products and equipment,older Pb-
.. read more
PCB Materials Behaviours towards Humidity and Impact of the Design,Finishes,Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability
As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and
process controls but also risks knowledge. To overcome humidity issue,par
.. read more
Lead Free Process Transition Solder Paste Characteristic Assessment
The migration to Lead Free raw materials in the Electronics Industry will happen faster than the date proposed in the original
draft of the legislation. A true Pb-free solution for product such
.. read more
The Study,Measurement,and Prevention of Tarnish on Immersion Silver Board Finishes
With increased environmental legislation against lead in the electronics industry1,circuit board manufacturers are
expecting chemical suppliers to formulate lead free alternatives with the same
.. read more
Avoiding the Solder Void
Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the
total void content is minimal. X-ray methods are the predominate method for so
.. read more
Equipment Impacts of Lead Free Wave Soldering
The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today’s
Wave Solder systems. Users are experiencing higher maintenance frequency and re
.. read more
Formation and Growth of Intermetallics at the Interface between Lead-free Solders and Copper Substrates
Intermetallic formation and growth were studied for the alloys Sn-3.2Ag-0.8Cu,Sn-3.5Ag,Sn-0.7Cu,and Sn-9Zn.
Coupons of solder joints (prepared by melting some of each solder alloy on a copper-p
.. read more