Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A STUDY OF PLANAR MICROVOIDING IN Pb-FREE SOLDER JOINTS
Planar microvoids have been observed on second level interconnections between solder metallizations and copper lands on PCB boards with immersion silver surface finish. These planar microvoids
.. read more
Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing
For some years now,an area ratio of 0.66 or greater has been the criterion for stencil apertures to achieve acceptable volume control in the printed solder paste “brick,” for small apertures Me
.. read more
Critical Cleaning of Highly Densed Electronic Assemblies in the Lead Free
An important development in high reliability electronics is the convergence of circuit board and advanced packaging technologies. This combination enhances the best attributes of each technolog
.. read more
Corrosion Resistance of PWB Final Finishes
As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi
.. read more
Liquid Tin Corrosion and Lead Free Wave Soldering
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The l
.. read more
LOWERING LAYERS w/HDI for RoHS ROBUSTNESS
A perplexing challenge for RoHS compliance is adapting large,complex and thick,high-layer count multilayers to lead-free assembly. These are typically dense,complex assemblies with large BGAs a
.. read more
Reflow Process Control Monitoring,and Data Logging
With the introduction of lead free electronics assembly worldwide,greater concerns are raised over factory control of materials and processes. Due to the mix of both leaded and lead free produc
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Effect of OSP Chemistry on the Hole Fill Performance During Pb-free Wave Soldering
This paper analyzes the differences in plated through hole fill performance between the regular OSP and Pb-free OSP PCB surface finish chemistries in a Pb-free wave solder process. The variable
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more
Reflow Defects with Lead-Free Soldering Moisture Sensitive Components
Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav
.. read more
Describing Key Coating and Process Characteristics of a Pb-Free OSP Process
Organic Solderability Preservatives (OSP) continue to attract significant attention as circuit board final finishes. They have evolved from simple and thin benzotriazole coatings to thicker and
.. read more
Visual and Reliability Testing Results of Circuit Boards Assembled with Lead Free Components,Soldering Materials and Processes in a Simulated Production...
The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the
electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S
.. read more
Analysis of AXI Test on Fine Pitch Components between Lead Free and Tin/Lead Assembly
By now,most people in the industry understand how complex it is to convert a factory from using a Tin-Lead (Eutectic)
Solder process to a Lead Free process. The implementation of this change re
.. read more
Effect of Surface Finish,Reflow Profile and High Temperature Aging on Drop Test Reliability of Lead Free CSPs
Chip scale packages (CSPs) are widely used in portable electronic products. Mechanical drop testing is a critical reliability
requirement for these products. With the switch to lead free solder
.. read more
Reliability Tests of Lead Free Solder Joints
Reliability of RoHS compliant products is investigated in this study. Emphasis is placed on the lead free solder joint
reliability. Solder is the electrical and mechanical “glue” of electronics
.. read more
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. read more
Cleaning Lead Free prior to Conformal Coating? Risks and Implications
Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the
soldering steps significantly impair the cross linkage and can be sa
.. read more
A Comparison of Lead Free Solder Assembly Defluxing Processes
The enactment of the Restriction of Hazardous Substances (RoHS) Directive is prompting significant changes in solder paste
formulations and their process conditions as manufacturers move to Lea
.. read more
Development of Lead Free Paste for Small Reflow Ovens
Today,there exists a major push towards lead free soldering in the international electronics industry. It has presented a
number of challenges in both the surface mount and wave soldering proce
.. read more
Achieving Sn/Pb Void Performance Utilizing Lead Free Solder Pastes
One of the reported problems in moving to lead free has been increased solder voiding. Current research indicates that paste
formulation,reflow profile and board finish,when selected carefully,
.. read more
JCAA/JG-PP Lead Free Solder Project: Combined Solder Project: Combined Environments Test
A combined environment testing was conducted for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention
Lead free Solder project. The purpose of the project was to validate and
.. read more
Low Cost Lead Free Solution Evaluation for Electronic Consumer Applications
Lead products are no longer an option if you want to export to the EU market. RoHS regulations requiring the manufacture of
lead-free electronic products by July 2006 are pushing the industry t
.. read more
The Use of SAC Solder and Pb-Free Lead Materials in the Repair Scenario
Much work has been done involving the introduction of RoHS and WEEE Directives across the European Union and the
world. Although the use of Pb is limited in new products and equipment,older Pb-
.. read more
PCB Materials Behaviours towards Humidity and Impact of the Design,Finishes,Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability
As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and
process controls but also risks knowledge. To overcome humidity issue,par
.. read more
Lead Free Process Transition Solder Paste Characteristic Assessment
The migration to Lead Free raw materials in the Electronics Industry will happen faster than the date proposed in the original
draft of the legislation. A true Pb-free solution for product such
.. read more
Equipment Impacts of Lead Free Wave Soldering
The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today’s
Wave Solder systems. Users are experiencing higher maintenance frequency and re
.. read more
Formation and Growth of Intermetallics at the Interface between Lead-free Solders and Copper Substrates
Intermetallic formation and growth were studied for the alloys Sn-3.2Ag-0.8Cu,Sn-3.5Ag,Sn-0.7Cu,and Sn-9Zn.
Coupons of solder joints (prepared by melting some of each solder alloy on a copper-p
.. read more
Robust Optimization of a Lead Free SMT Process
This paper will focus on Dr. Taguchi’s Robust Engineering methodology,measurement methods and experimental
results for the optimization of a lead free SMT process for use in an Automotive Elect
.. read more
Lead Free Reflow Process Control
All areas of manufacturing worldwide are impacted
by the lead free initiative; none more than the reflow
process. The higher melt temperatures and soak
duration of leadless solder formulas requ
.. read more
A STUDY OF PLANAR MICROVOIDING IN Pb-FREE SOLDER JOINTS
Planar microvoids have been observed on second level interconnections between solder metallizations and copper lands on PCB boards with immersion silver surface finish. These planar microvoids
.. read more
Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing
For some years now,an area ratio of 0.66 or greater has been the criterion for stencil apertures to achieve acceptable volume control in the printed solder paste “brick,” for small apertures Me
.. read more
Critical Cleaning of Highly Densed Electronic Assemblies in the Lead Free
An important development in high reliability electronics is the convergence of circuit board and advanced packaging technologies. This combination enhances the best attributes of each technolog
.. read more
Corrosion Resistance of PWB Final Finishes
As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi
.. read more
Liquid Tin Corrosion and Lead Free Wave Soldering
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The l
.. read more
LOWERING LAYERS w/HDI for RoHS ROBUSTNESS
A perplexing challenge for RoHS compliance is adapting large,complex and thick,high-layer count multilayers to lead-free assembly. These are typically dense,complex assemblies with large BGAs a
.. read more
Reflow Process Control Monitoring,and Data Logging
With the introduction of lead free electronics assembly worldwide,greater concerns are raised over factory control of materials and processes. Due to the mix of both leaded and lead free produc
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Effect of OSP Chemistry on the Hole Fill Performance During Pb-free Wave Soldering
This paper analyzes the differences in plated through hole fill performance between the regular OSP and Pb-free OSP PCB surface finish chemistries in a Pb-free wave solder process. The variable
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more
Reflow Defects with Lead-Free Soldering Moisture Sensitive Components
Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav
.. read more
Describing Key Coating and Process Characteristics of a Pb-Free OSP Process
Organic Solderability Preservatives (OSP) continue to attract significant attention as circuit board final finishes. They have evolved from simple and thin benzotriazole coatings to thicker and
.. read more
Visual and Reliability Testing Results of Circuit Boards Assembled with Lead Free Components,Soldering Materials and Processes in a Simulated Production...
The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the
electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S
.. read more
Analysis of AXI Test on Fine Pitch Components between Lead Free and Tin/Lead Assembly
By now,most people in the industry understand how complex it is to convert a factory from using a Tin-Lead (Eutectic)
Solder process to a Lead Free process. The implementation of this change re
.. read more
Effect of Surface Finish,Reflow Profile and High Temperature Aging on Drop Test Reliability of Lead Free CSPs
Chip scale packages (CSPs) are widely used in portable electronic products. Mechanical drop testing is a critical reliability
requirement for these products. With the switch to lead free solder
.. read more
Reliability Tests of Lead Free Solder Joints
Reliability of RoHS compliant products is investigated in this study. Emphasis is placed on the lead free solder joint
reliability. Solder is the electrical and mechanical “glue” of electronics
.. read more
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. read more
Cleaning Lead Free prior to Conformal Coating? Risks and Implications
Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the
soldering steps significantly impair the cross linkage and can be sa
.. read more
A Comparison of Lead Free Solder Assembly Defluxing Processes
The enactment of the Restriction of Hazardous Substances (RoHS) Directive is prompting significant changes in solder paste
formulations and their process conditions as manufacturers move to Lea
.. read more
Development of Lead Free Paste for Small Reflow Ovens
Today,there exists a major push towards lead free soldering in the international electronics industry. It has presented a
number of challenges in both the surface mount and wave soldering proce
.. read more
Achieving Sn/Pb Void Performance Utilizing Lead Free Solder Pastes
One of the reported problems in moving to lead free has been increased solder voiding. Current research indicates that paste
formulation,reflow profile and board finish,when selected carefully,
.. read more
JCAA/JG-PP Lead Free Solder Project: Combined Solder Project: Combined Environments Test
A combined environment testing was conducted for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention
Lead free Solder project. The purpose of the project was to validate and
.. read more
Low Cost Lead Free Solution Evaluation for Electronic Consumer Applications
Lead products are no longer an option if you want to export to the EU market. RoHS regulations requiring the manufacture of
lead-free electronic products by July 2006 are pushing the industry t
.. read more
The Use of SAC Solder and Pb-Free Lead Materials in the Repair Scenario
Much work has been done involving the introduction of RoHS and WEEE Directives across the European Union and the
world. Although the use of Pb is limited in new products and equipment,older Pb-
.. read more
PCB Materials Behaviours towards Humidity and Impact of the Design,Finishes,Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability
As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and
process controls but also risks knowledge. To overcome humidity issue,par
.. read more
Lead Free Process Transition Solder Paste Characteristic Assessment
The migration to Lead Free raw materials in the Electronics Industry will happen faster than the date proposed in the original
draft of the legislation. A true Pb-free solution for product such
.. read more
Equipment Impacts of Lead Free Wave Soldering
The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today’s
Wave Solder systems. Users are experiencing higher maintenance frequency and re
.. read more
Formation and Growth of Intermetallics at the Interface between Lead-free Solders and Copper Substrates
Intermetallic formation and growth were studied for the alloys Sn-3.2Ag-0.8Cu,Sn-3.5Ag,Sn-0.7Cu,and Sn-9Zn.
Coupons of solder joints (prepared by melting some of each solder alloy on a copper-p
.. read more
Robust Optimization of a Lead Free SMT Process
This paper will focus on Dr. Taguchi’s Robust Engineering methodology,measurement methods and experimental
results for the optimization of a lead free SMT process for use in an Automotive Elect
.. read more
Lead Free Reflow Process Control
All areas of manufacturing worldwide are impacted
by the lead free initiative; none more than the reflow
process. The higher melt temperatures and soak
duration of leadless solder formulas requ
.. read more