Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more
SELECTION OF WAVE SOLDERING FLUXES FOR LEAD-FREE ASSEMBLY
The process challenges of lead-free wave soldering often require the use of new flux chemistries when compared with the relatively tolerant tin-lead wave soldering process. In some cases,the fl
.. read more
Aerospace Response to Lead-free Solder - A Program Manager’s Guide
On July 1,2006,lead and certain other hazardous materials were banned from most forms of new electronic equipment in the countries of the European Union. Although most aerospace products are no
.. read more
Lead-free Rework Experiences Using SAC and Sn-Cu Based Alloys
As companies transition over to lead-free assembly a certain amount of hand-soldering and rework will be performed. An article from Tech Search International last year did state that in Asia wh
.. read more
Flux Application for Lead-Free Wave Soldering
Lead-free wave soldering requires tighter process control than soldering with lead based alloys. A key area of the machine that impacts the ability to solder lead-free alloys without defects is
.. read more
Experience in Processing EEE Components with Pure Electroplated Tin Leads As a
The regulatory measures defined in MIL performance standards that govern production of active and passive electronic components ban the application of pure Sn plated leads for EEE parts. The st
.. read more
New Methods to Efficiently Test the Reliability of Plated Vias and to Model Plated Via Life from Laminate Material Data
This paper continues work by Sun Microsystems and the University of Maryland,CALCE[1] to predict plated through via life using laminate material properties,plated copper material properties,and
.. read more
Measuring the True Wetting Time of Solders
As the electronics industry prepares to meet the requirements of the European Community’s RoHS directive on lead in electrical and electronic equipment an issue about which concern is frequentl
.. read more
Lead Free Assembly Impacts on Laminate Material Properties and “Pad Crater” Failures
Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress
.. read more
A DOE to assess PCB fabrication material design and process using IST (Interconnect Stress Testing) to improve fine pitch BGA...
During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer
.. read more
A Symphony of Synergy: How Certification to the IECQ HSPM Specification
The IPC's Lead Free program addresses one of the 6 Hazardous Substances regulated by the RoHS directive. Certification to the QC 080000,the IECQ HSPM Specification,addresses the other 5 Hazardo
.. read more
A STUDY OF PLANAR MICROVOIDING IN Pb-FREE SOLDER JOINTS
Planar microvoids have been observed on second level interconnections between solder metallizations and copper lands on PCB boards with immersion silver surface finish. These planar microvoids
.. read more
Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing
For some years now,an area ratio of 0.66 or greater has been the criterion for stencil apertures to achieve acceptable volume control in the printed solder paste “brick,” for small apertures Me
.. read more
Hybrid Drying Technology for In-line Aqueous
boards in the in-line aqueous cleaning process. As lead-free circuit boards become more complex and component spacing
decreases,the effectiveness of direct blow-off drying is greatly diminished
.. read more
Corrosion Resistance of PWB Final Finishes
As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi
.. read more
Optimizing Pallet Materials for Long Life and Ease of Machining
This paper will present seven different materials used for the production of both wave solder and reflow solder pallets. The goal of this study will be for the purpose of depicting machining ca
.. read more
LOWERING LAYERS w/HDI for RoHS ROBUSTNESS
A perplexing challenge for RoHS compliance is adapting large,complex and thick,high-layer count multilayers to lead-free assembly. These are typically dense,complex assemblies with large BGAs a
.. read more
Applied Research for Optimizing Process: Parameters for Cleaning Pb-Free Flux
As the electronics industry moves toward the implementation of Pb-free soldering,the impact on the assembly process must
be considered. One process that is often over looked is the cleaning of
.. read more
Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production
With the latest legislations from RoHS and WEEE dominating the horizon of the PCB landscape there is a need for
manufacturers and their suppliers to understand their impacts. The requirement to
.. read more
Industry Challenges with China Environmental Product Regulations
Since the issue of the European Union directive [1] on the restriction of the use of certain hazardous substances in electrical
and electronic equipment (RoHS) and its predecessor WEEE directiv
.. read more
Observations on the Influences of Various Parameters on Pb-free Solder Joint Appearance and Strength
A designed experiment evaluated the influence of several variables on visual appearance and strength of Pb-free solder joints.
Components,with leads finished with nickel-palladium-gold (NiPdAu)
.. read more
Surface Tarnish and Creeping Corrosion on Pb-Free Circuit Board Surface Finishes
The deployment of non-Lead (Pb) surface finishes is well underway throughout the electronics industry. Printed circuit boards,which for many years had relied on Hot Air Solder Level (HASL) fini
.. read more
A Reliability Comparison of Different Lead-Free Alloys and Surface Finishes in SMT Assembly
As we inch towards the somewhat shifting deadlines towards lead (Pb) restriction in Japan and Europe,there is an increase
seen in the amount of studies performed for electronics assemblies sold
.. read more
SMT Assembly Process Comparison of Pb-free Alloy Systems
This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle
designed to resemble real world manufacturing applications. Four different Pb-free a
.. read more
Taking the Pain Out of Pb-Free Reflow
The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process.
The largest changes are in the reflow process,as Pb-free pastes requ
.. read more
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more
SELECTION OF WAVE SOLDERING FLUXES FOR LEAD-FREE ASSEMBLY
The process challenges of lead-free wave soldering often require the use of new flux chemistries when compared with the relatively tolerant tin-lead wave soldering process. In some cases,the fl
.. read more
Aerospace Response to Lead-free Solder - A Program Manager’s Guide
On July 1,2006,lead and certain other hazardous materials were banned from most forms of new electronic equipment in the countries of the European Union. Although most aerospace products are no
.. read more
Lead-free Rework Experiences Using SAC and Sn-Cu Based Alloys
As companies transition over to lead-free assembly a certain amount of hand-soldering and rework will be performed. An article from Tech Search International last year did state that in Asia wh
.. read more
Flux Application for Lead-Free Wave Soldering
Lead-free wave soldering requires tighter process control than soldering with lead based alloys. A key area of the machine that impacts the ability to solder lead-free alloys without defects is
.. read more
Experience in Processing EEE Components with Pure Electroplated Tin Leads As a
The regulatory measures defined in MIL performance standards that govern production of active and passive electronic components ban the application of pure Sn plated leads for EEE parts. The st
.. read more
New Methods to Efficiently Test the Reliability of Plated Vias and to Model Plated Via Life from Laminate Material Data
This paper continues work by Sun Microsystems and the University of Maryland,CALCE[1] to predict plated through via life using laminate material properties,plated copper material properties,and
.. read more
Measuring the True Wetting Time of Solders
As the electronics industry prepares to meet the requirements of the European Community’s RoHS directive on lead in electrical and electronic equipment an issue about which concern is frequentl
.. read more
Lead Free Assembly Impacts on Laminate Material Properties and “Pad Crater” Failures
Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress
.. read more
A DOE to assess PCB fabrication material design and process using IST (Interconnect Stress Testing) to improve fine pitch BGA...
During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer
.. read more
A Symphony of Synergy: How Certification to the IECQ HSPM Specification
The IPC's Lead Free program addresses one of the 6 Hazardous Substances regulated by the RoHS directive. Certification to the QC 080000,the IECQ HSPM Specification,addresses the other 5 Hazardo
.. read more
A STUDY OF PLANAR MICROVOIDING IN Pb-FREE SOLDER JOINTS
Planar microvoids have been observed on second level interconnections between solder metallizations and copper lands on PCB boards with immersion silver surface finish. These planar microvoids
.. read more
Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing
For some years now,an area ratio of 0.66 or greater has been the criterion for stencil apertures to achieve acceptable volume control in the printed solder paste “brick,” for small apertures Me
.. read more
Hybrid Drying Technology for In-line Aqueous
boards in the in-line aqueous cleaning process. As lead-free circuit boards become more complex and component spacing
decreases,the effectiveness of direct blow-off drying is greatly diminished
.. read more
Corrosion Resistance of PWB Final Finishes
As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi
.. read more
Optimizing Pallet Materials for Long Life and Ease of Machining
This paper will present seven different materials used for the production of both wave solder and reflow solder pallets. The goal of this study will be for the purpose of depicting machining ca
.. read more
LOWERING LAYERS w/HDI for RoHS ROBUSTNESS
A perplexing challenge for RoHS compliance is adapting large,complex and thick,high-layer count multilayers to lead-free assembly. These are typically dense,complex assemblies with large BGAs a
.. read more
Applied Research for Optimizing Process: Parameters for Cleaning Pb-Free Flux
As the electronics industry moves toward the implementation of Pb-free soldering,the impact on the assembly process must
be considered. One process that is often over looked is the cleaning of
.. read more
Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production
With the latest legislations from RoHS and WEEE dominating the horizon of the PCB landscape there is a need for
manufacturers and their suppliers to understand their impacts. The requirement to
.. read more
Industry Challenges with China Environmental Product Regulations
Since the issue of the European Union directive [1] on the restriction of the use of certain hazardous substances in electrical
and electronic equipment (RoHS) and its predecessor WEEE directiv
.. read more
Observations on the Influences of Various Parameters on Pb-free Solder Joint Appearance and Strength
A designed experiment evaluated the influence of several variables on visual appearance and strength of Pb-free solder joints.
Components,with leads finished with nickel-palladium-gold (NiPdAu)
.. read more
Surface Tarnish and Creeping Corrosion on Pb-Free Circuit Board Surface Finishes
The deployment of non-Lead (Pb) surface finishes is well underway throughout the electronics industry. Printed circuit boards,which for many years had relied on Hot Air Solder Level (HASL) fini
.. read more
A Reliability Comparison of Different Lead-Free Alloys and Surface Finishes in SMT Assembly
As we inch towards the somewhat shifting deadlines towards lead (Pb) restriction in Japan and Europe,there is an increase
seen in the amount of studies performed for electronics assemblies sold
.. read more
SMT Assembly Process Comparison of Pb-free Alloy Systems
This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle
designed to resemble real world manufacturing applications. Four different Pb-free a
.. read more
Taking the Pain Out of Pb-Free Reflow
The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process.
The largest changes are in the reflow process,as Pb-free pastes requ
.. read more