Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Reflow Defects with Lead-Free Soldering Moisture Sensitive Components
Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav
.. read more
Lead Free Processing and other Thermal Challenges for Flexible Printed Circuits
In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric
.. read more
Durability of Repaired and Aged Lead-free Electronic Assemblies
The reliability of aged and repaired lead-free and mixed lead-free/lead-based solder interconnects is an important issue for electronic equipment manufacturers. As a result of the global transi
.. read more
Lead Free Assembly Qualification of ALIVH Boards
The migration to lead free reflow is bringing many challenges for the PCB industry. High Tg laminates,stability of materials thru 2X reflows,rework,moisture sensitivity etc. This requires caref
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
Durability of Repaired and Aged Lead-free Electronic Assemblies
The reliability of aged and repaired lead-free and mixed lead-free/lead-based solder interconnects is an important issue for electronic equipment manufacturers. As a result of the global transi
.. read more
Large and Thick Board Lead-Free Wave Soldering Optimization
This paper presents the results of our study on the development and optimization of lead-free wave soldering process for large and thick printed circuit boards (PCB),through multiple designs of
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more
SELECTION OF WAVE SOLDERING FLUXES FOR LEAD-FREE ASSEMBLY
The process challenges of lead-free wave soldering often require the use of new flux chemistries when compared with the relatively tolerant tin-lead wave soldering process. In some cases,the fl
.. read more
Aerospace Response to Lead-free Solder - A Program Manager’s Guide
On July 1,2006,lead and certain other hazardous materials were banned from most forms of new electronic equipment in the countries of the European Union. Although most aerospace products are no
.. read more
Lead-free Rework Experiences Using SAC and Sn-Cu Based Alloys
As companies transition over to lead-free assembly a certain amount of hand-soldering and rework will be performed. An article from Tech Search International last year did state that in Asia wh
.. read more
Flux Application for Lead-Free Wave Soldering
Lead-free wave soldering requires tighter process control than soldering with lead based alloys. A key area of the machine that impacts the ability to solder lead-free alloys without defects is
.. read more
Experience in Processing EEE Components with Pure Electroplated Tin Leads As a
The regulatory measures defined in MIL performance standards that govern production of active and passive electronic components ban the application of pure Sn plated leads for EEE parts. The st
.. read more
New Methods to Efficiently Test the Reliability of Plated Vias and to Model Plated Via Life from Laminate Material Data
This paper continues work by Sun Microsystems and the University of Maryland,CALCE[1] to predict plated through via life using laminate material properties,plated copper material properties,and
.. read more
Measuring the True Wetting Time of Solders
As the electronics industry prepares to meet the requirements of the European Community’s RoHS directive on lead in electrical and electronic equipment an issue about which concern is frequentl
.. read more
Lead Free Assembly Impacts on Laminate Material Properties and “Pad Crater” Failures
Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress
.. read more
Industry Challenges with China Environmental Product Regulations
Since the issue of the European Union directive [1] on the restriction of the use of certain hazardous substances in electrical
and electronic equipment (RoHS) and its predecessor WEEE directiv
.. read more
Observations on the Influences of Various Parameters on Pb-free Solder Joint Appearance and Strength
A designed experiment evaluated the influence of several variables on visual appearance and strength of Pb-free solder joints.
Components,with leads finished with nickel-palladium-gold (NiPdAu)
.. read more
Applied Research for Optimizing Process: Parameters for Cleaning Pb-Free Flux
As the electronics industry moves toward the implementation of Pb-free soldering,the impact on the assembly process must
be considered. One process that is often over looked is the cleaning of
.. read more
Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production
With the latest legislations from RoHS and WEEE dominating the horizon of the PCB landscape there is a need for
manufacturers and their suppliers to understand their impacts. The requirement to
.. read more
Surface Tarnish and Creeping Corrosion on Pb-Free Circuit Board Surface Finishes
The deployment of non-Lead (Pb) surface finishes is well underway throughout the electronics industry. Printed circuit boards,which for many years had relied on Hot Air Solder Level (HASL) fini
.. read more
A Reliability Comparison of Different Lead-Free Alloys and Surface Finishes in SMT Assembly
As we inch towards the somewhat shifting deadlines towards lead (Pb) restriction in Japan and Europe,there is an increase
seen in the amount of studies performed for electronics assemblies sold
.. read more
SMT Assembly Process Comparison of Pb-free Alloy Systems
This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle
designed to resemble real world manufacturing applications. Four different Pb-free a
.. read more
Taking the Pain Out of Pb-Free Reflow
The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process.
The largest changes are in the reflow process,as Pb-free pastes requ
.. read more
Reflow Defects with Lead-Free Soldering Moisture Sensitive Components
Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav
.. read more
Lead Free Processing and other Thermal Challenges for Flexible Printed Circuits
In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric
.. read more
Durability of Repaired and Aged Lead-free Electronic Assemblies
The reliability of aged and repaired lead-free and mixed lead-free/lead-based solder interconnects is an important issue for electronic equipment manufacturers. As a result of the global transi
.. read more
Lead Free Assembly Qualification of ALIVH Boards
The migration to lead free reflow is bringing many challenges for the PCB industry. High Tg laminates,stability of materials thru 2X reflows,rework,moisture sensitivity etc. This requires caref
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
Durability of Repaired and Aged Lead-free Electronic Assemblies
The reliability of aged and repaired lead-free and mixed lead-free/lead-based solder interconnects is an important issue for electronic equipment manufacturers. As a result of the global transi
.. read more
Large and Thick Board Lead-Free Wave Soldering Optimization
This paper presents the results of our study on the development and optimization of lead-free wave soldering process for large and thick printed circuit boards (PCB),through multiple designs of
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more
SELECTION OF WAVE SOLDERING FLUXES FOR LEAD-FREE ASSEMBLY
The process challenges of lead-free wave soldering often require the use of new flux chemistries when compared with the relatively tolerant tin-lead wave soldering process. In some cases,the fl
.. read more
Aerospace Response to Lead-free Solder - A Program Manager’s Guide
On July 1,2006,lead and certain other hazardous materials were banned from most forms of new electronic equipment in the countries of the European Union. Although most aerospace products are no
.. read more
Lead-free Rework Experiences Using SAC and Sn-Cu Based Alloys
As companies transition over to lead-free assembly a certain amount of hand-soldering and rework will be performed. An article from Tech Search International last year did state that in Asia wh
.. read more
Flux Application for Lead-Free Wave Soldering
Lead-free wave soldering requires tighter process control than soldering with lead based alloys. A key area of the machine that impacts the ability to solder lead-free alloys without defects is
.. read more
Experience in Processing EEE Components with Pure Electroplated Tin Leads As a
The regulatory measures defined in MIL performance standards that govern production of active and passive electronic components ban the application of pure Sn plated leads for EEE parts. The st
.. read more
New Methods to Efficiently Test the Reliability of Plated Vias and to Model Plated Via Life from Laminate Material Data
This paper continues work by Sun Microsystems and the University of Maryland,CALCE[1] to predict plated through via life using laminate material properties,plated copper material properties,and
.. read more
Measuring the True Wetting Time of Solders
As the electronics industry prepares to meet the requirements of the European Community’s RoHS directive on lead in electrical and electronic equipment an issue about which concern is frequentl
.. read more
Lead Free Assembly Impacts on Laminate Material Properties and “Pad Crater” Failures
Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress
.. read more
Industry Challenges with China Environmental Product Regulations
Since the issue of the European Union directive [1] on the restriction of the use of certain hazardous substances in electrical
and electronic equipment (RoHS) and its predecessor WEEE directiv
.. read more
Observations on the Influences of Various Parameters on Pb-free Solder Joint Appearance and Strength
A designed experiment evaluated the influence of several variables on visual appearance and strength of Pb-free solder joints.
Components,with leads finished with nickel-palladium-gold (NiPdAu)
.. read more
Applied Research for Optimizing Process: Parameters for Cleaning Pb-Free Flux
As the electronics industry moves toward the implementation of Pb-free soldering,the impact on the assembly process must
be considered. One process that is often over looked is the cleaning of
.. read more
Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production
With the latest legislations from RoHS and WEEE dominating the horizon of the PCB landscape there is a need for
manufacturers and their suppliers to understand their impacts. The requirement to
.. read more
Surface Tarnish and Creeping Corrosion on Pb-Free Circuit Board Surface Finishes
The deployment of non-Lead (Pb) surface finishes is well underway throughout the electronics industry. Printed circuit boards,which for many years had relied on Hot Air Solder Level (HASL) fini
.. read more
A Reliability Comparison of Different Lead-Free Alloys and Surface Finishes in SMT Assembly
As we inch towards the somewhat shifting deadlines towards lead (Pb) restriction in Japan and Europe,there is an increase
seen in the amount of studies performed for electronics assemblies sold
.. read more
SMT Assembly Process Comparison of Pb-free Alloy Systems
This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle
designed to resemble real world manufacturing applications. Four different Pb-free a
.. read more
Taking the Pain Out of Pb-Free Reflow
The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process.
The largest changes are in the reflow process,as Pb-free pastes requ
.. read more