Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Current and Emerging Gaps in Standards for Semiconductor Assembly Materials in the Era of 2.5D and 3D Dimensional Devices
What’s the Future of Interposers for Semiconductor IC Packaging?
.. read more
Finite Element Analysis of Flip Chip Ball Grid Array Packages for BGA Life Prediction: 2D,3D or Axisymmetric?
A variety of mechanical and thermal stress related problems related to Flip Chip Ball Grid Array Packages (FCBGAs) are
often solved by the Finite Element Method. Often,the question for the stre
.. read more
3-D Packaging: Innovative Solutions for Multiple Die Applications
A vertically configured package technology developed by Tessera is proving to be a practical multi-die solution for any
number of single and multiple functional combinations. The enabling techn
.. read more
Comparison of X-ray Inspection Systems for BGA/CCGA Quality Assurance and Crack Detection
For high reliability applications,the use of x-ray technique has become an additional inspection requirement for
quality control and detection of unique defects due to manufacturing of advanced
.. read more
2D Off-line X-ray Inspection in the SMT Production Line: Working Towards the Zero-Defect Goal
The goal of SMT production is a zero-defect process in which flawed materials never get to the customer; however,
in the ideal scenario,zero-defect production would mean that no flawed products
.. read more
Current and Emerging Gaps in Standards for Semiconductor Assembly Materials in the Era of 2.5D and 3D Dimensional Devices
What’s the Future of Interposers for Semiconductor IC Packaging?
.. read more
Finite Element Analysis of Flip Chip Ball Grid Array Packages for BGA Life Prediction: 2D,3D or Axisymmetric?
A variety of mechanical and thermal stress related problems related to Flip Chip Ball Grid Array Packages (FCBGAs) are
often solved by the Finite Element Method. Often,the question for the stre
.. read more
3-D Packaging: Innovative Solutions for Multiple Die Applications
A vertically configured package technology developed by Tessera is proving to be a practical multi-die solution for any
number of single and multiple functional combinations. The enabling techn
.. read more
Comparison of X-ray Inspection Systems for BGA/CCGA Quality Assurance and Crack Detection
For high reliability applications,the use of x-ray technique has become an additional inspection requirement for
quality control and detection of unique defects due to manufacturing of advanced
.. read more
2D Off-line X-ray Inspection in the SMT Production Line: Working Towards the Zero-Defect Goal
The goal of SMT production is a zero-defect process in which flawed materials never get to the customer; however,
in the ideal scenario,zero-defect production would mean that no flawed products
.. read more