Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Printed Circuit Structures,the Evolution of Printed Circuit Boards

The Printed Circuit Board (PCB) is the backbone of electronics and a large number of consumer devices. The challenge to put more function in a smaller space requires more components utilizing s .. read more

Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology

The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st .. read more

Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR

For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics miniaturization and densification. Numerous technologies issued from v .. read more

Market Forecast and Applications for 3D Packaging using Package-on-Package (PoP)

- 3D Manufacturing solutions: Flexible integration - 3D/SiP Cost of Ownership - Die vs. Package Stack Analysis - Smartphone - Package evolution - Handheld Processor Roadmap - PoP - TMV - Future .. read more

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure devi .. read more

Ultra-Thin 3D Package Development and Qualification Testing

The motivation for developing higher density IC packaging continues to be the personal entertainment and the portable handset markets. Consumers? expectations are that each new generation of pr .. read more

Utilizing 3D Package Technology for Complex SiP Applications - Innovative Solutions for System Level Integration and Miniaturization

Hand-held communication and entertainment products continue to dominate the consumer markets worldwide,and with each generation,companies are offering more and more features and/or capability. .. read more

Printed Circuit Structures,the Evolution of Printed Circuit Boards

The Printed Circuit Board (PCB) is the backbone of electronics and a large number of consumer devices. The challenge to put more function in a smaller space requires more components utilizing s .. read more

Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology

The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st .. read more

Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR

For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics miniaturization and densification. Numerous technologies issued from v .. read more

Market Forecast and Applications for 3D Packaging using Package-on-Package (PoP)

- 3D Manufacturing solutions: Flexible integration - 3D/SiP Cost of Ownership - Die vs. Package Stack Analysis - Smartphone - Package evolution - Handheld Processor Roadmap - PoP - TMV - Future .. read more

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure devi .. read more

Ultra-Thin 3D Package Development and Qualification Testing

The motivation for developing higher density IC packaging continues to be the personal entertainment and the portable handset markets. Consumers? expectations are that each new generation of pr .. read more

Utilizing 3D Package Technology for Complex SiP Applications - Innovative Solutions for System Level Integration and Miniaturization

Hand-held communication and entertainment products continue to dominate the consumer markets worldwide,and with each generation,companies are offering more and more features and/or capability. .. read more