Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Low Temperature SMT Solder Evaluation
The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional
.. read more
Acceptance Testing of Low-Ag Reflow Solder Alloys
Since the implementation of the European Union RoHS directive in 2006,the electronics industry has seen an expansion of available low-silver lead (Pb)-free alloys for wave soldering,miniwave re
.. read more
Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo
.. read more
The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array
Accelerated temperature cycling was used to evaluate the thermal fatigue reliability for the case of backward compatible
assembly (mixed alloy,Pb-free BGA/SnPb paste) of a 3162 pin count,extrem
.. read more
Low-Silver BGA Assembly Phase II – Reliability Assessment Seventh Report: Mixed Metallurgy Solder Joint Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents and often with “micro alloying” additions. There are
.. read more
Challenges in Reflow Profiling Large and High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes
Backward Compatibility of Pb free SnAgCu (SAC) solders with conventional SnPb soldering has been a subject of considerable interest since the introduction of Pb free solders earlier in this dec
.. read more
Bare Board Material Performance after Pb-free Reflow
This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r
.. read more
Comparison of Thermal Fatigue Performance of SAC105 (Sn-1.0Ag-0.5Cu),Sn- 3.5Ag,and SAC305 (Sn-3.0Ag-0.5Cu) BGA Components with SAC305 Solder Paste
Many BGA and CSP component suppliers have begun shipment of components with a variety of “second generation” Pb-free solder ball alloys. Much of the motivation for the alloy changes has been to
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since July 1st 2006,the 2002/95/EC RoHS European directive has forced the electronic industry to switch from Tin-Lead to lead-free soldering alloys for components assembly.
Exemption domains ha
.. read more
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more
Investigation of the Manufacturing Challenges of 2577 I/O Flip Chip Ball Grid Arrays
Higher I/O Ball Grid Arrays (BGAs) are high speed,high pin count,and high performance array packages. These BGAs are
also more complex in structure than “standard” BGAs and are generally target
.. read more
Low Temperature SMT Solder Evaluation
The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional
.. read more
Acceptance Testing of Low-Ag Reflow Solder Alloys
Since the implementation of the European Union RoHS directive in 2006,the electronics industry has seen an expansion of available low-silver lead (Pb)-free alloys for wave soldering,miniwave re
.. read more
Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo
.. read more
The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array
Accelerated temperature cycling was used to evaluate the thermal fatigue reliability for the case of backward compatible
assembly (mixed alloy,Pb-free BGA/SnPb paste) of a 3162 pin count,extrem
.. read more
Low-Silver BGA Assembly Phase II – Reliability Assessment Seventh Report: Mixed Metallurgy Solder Joint Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents and often with “micro alloying” additions. There are
.. read more
Challenges in Reflow Profiling Large and High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes
Backward Compatibility of Pb free SnAgCu (SAC) solders with conventional SnPb soldering has been a subject of considerable interest since the introduction of Pb free solders earlier in this dec
.. read more
Bare Board Material Performance after Pb-free Reflow
This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r
.. read more
Comparison of Thermal Fatigue Performance of SAC105 (Sn-1.0Ag-0.5Cu),Sn- 3.5Ag,and SAC305 (Sn-3.0Ag-0.5Cu) BGA Components with SAC305 Solder Paste
Many BGA and CSP component suppliers have begun shipment of components with a variety of “second generation” Pb-free solder ball alloys. Much of the motivation for the alloy changes has been to
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since July 1st 2006,the 2002/95/EC RoHS European directive has forced the electronic industry to switch from Tin-Lead to lead-free soldering alloys for components assembly.
Exemption domains ha
.. read more
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more
Investigation of the Manufacturing Challenges of 2577 I/O Flip Chip Ball Grid Arrays
Higher I/O Ball Grid Arrays (BGAs) are high speed,high pin count,and high performance array packages. These BGAs are
also more complex in structure than “standard” BGAs and are generally target
.. read more