Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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System in Package (SiP) and CSPs Underfilling on Reliability
This paper presents assembly challenges and reliability evaluation by thermal cycling for a 2.5D [aka, System in Package (SiP)]in a fine pitch ball grid array (FPBGA). More importantly, it p
.. read more
Effect of Voiding on Solder Joint Shock and Thermal Cycle Reliability
Solder joint void has been considered a typical phenomenon in electronics assembly. Voids are caused by entrapped gases
produced during flux volatilization during SMT,air entrapment in plated t
.. read more
System in Package (SiP) and CSPs Underfilling on Reliability
This paper presents assembly challenges and reliability evaluation by thermal cycling for a 2.5D [aka, System in Package (SiP)]in a fine pitch ball grid array (FPBGA). More importantly, it p
.. read more
Effect of Voiding on Solder Joint Shock and Thermal Cycle Reliability
Solder joint void has been considered a typical phenomenon in electronics assembly. Voids are caused by entrapped gases
produced during flux volatilization during SMT,air entrapment in plated t
.. read more