Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Acid Copper Electroplating Processes With Excellent V-Pit Resistance for Flash Etching
Driven by rapid changes and markets, the electronics industry has seen massive growth over the past few decades. The short product life cycle has pushed PCB fabrication technology to its lim
.. read more
Mixed Metal Oxide "MMO" Insoluble Anode System for Enhanced Operational Acid Copper Plating of Printed Wire Boards "PWB"
Advances in the printed wire board industry toward miniaturization,finer traces and HDI technology,smaller through-holes and microvias have placed higher demands on board design,manufacturabili
.. read more
Via Fill and Through Hole Plating Process with Enhanced TH Microdistribution
The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important tec
.. read more
Electroplated Copper Filling of Through Holes on Varying Substrate Thickness
This paper discusses a through hole copper filling process for application to high density interconnects constructions and IC substrates. The process consists two acid copper plating cycles. Th
.. read more
The Perfect Copper Surface
In order to provide the functionality in today’s electronics,printed circuit boards are approaching the complexity of semiconductors. For flexible circuits with 1 mil lines and spaces,this mean
.. read more
Results of Fabrication DOE for DuPont Pyralux TK®,A Low Dielectric,Thin Flexible Circuit Material
From the first time we heard of new thin,low Dk,flex laminate material from DuPont we were excited. The material is what is now known,and commercially available,as DuPont’s Pyralux TK®. Working
.. read more
Production of Flexible Circuits in Reel to Reel Horizontal Production Systems
Reel to reel production of flexible circuits where the substrate consists of a continuous roll is a technique commonly used in mass production. This method is an obvious solution for efficient
.. read more
Reliable Acid Copper Plating for Metallization of PCB
Copper plating is widely used in the electronic industry for fabrication of electronic devices. It is particularly useful for
fabrication of printed circuit boards and semiconductors. Copper is
.. read more
Processing High Density Interconnects: Selecting the Best Option for Via Fill Applications
With the increased use of High Density Interconnects in printed wiring boards (PWB) there is a critical need for reliable methods to completely fill through hole and blind vias. Complete fillin
.. read more
Characterization of Acid Copper Plating Solution for Via-Filling
The use of acid copper plating process for via-filling effectively forms interlayer connection in build-up PWBs with
high-density interconnections. However,in the case of copper film deposited
.. read more
Acid Copper Electroplating Processes With Excellent V-Pit Resistance for Flash Etching
Driven by rapid changes and markets, the electronics industry has seen massive growth over the past few decades. The short product life cycle has pushed PCB fabrication technology to its lim
.. read more
Mixed Metal Oxide "MMO" Insoluble Anode System for Enhanced Operational Acid Copper Plating of Printed Wire Boards "PWB"
Advances in the printed wire board industry toward miniaturization,finer traces and HDI technology,smaller through-holes and microvias have placed higher demands on board design,manufacturabili
.. read more
Via Fill and Through Hole Plating Process with Enhanced TH Microdistribution
The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important tec
.. read more
Electroplated Copper Filling of Through Holes on Varying Substrate Thickness
This paper discusses a through hole copper filling process for application to high density interconnects constructions and IC substrates. The process consists two acid copper plating cycles. Th
.. read more
The Perfect Copper Surface
In order to provide the functionality in today’s electronics,printed circuit boards are approaching the complexity of semiconductors. For flexible circuits with 1 mil lines and spaces,this mean
.. read more
Results of Fabrication DOE for DuPont Pyralux TK®,A Low Dielectric,Thin Flexible Circuit Material
From the first time we heard of new thin,low Dk,flex laminate material from DuPont we were excited. The material is what is now known,and commercially available,as DuPont’s Pyralux TK®. Working
.. read more
Production of Flexible Circuits in Reel to Reel Horizontal Production Systems
Reel to reel production of flexible circuits where the substrate consists of a continuous roll is a technique commonly used in mass production. This method is an obvious solution for efficient
.. read more
Reliable Acid Copper Plating for Metallization of PCB
Copper plating is widely used in the electronic industry for fabrication of electronic devices. It is particularly useful for
fabrication of printed circuit boards and semiconductors. Copper is
.. read more
Processing High Density Interconnects: Selecting the Best Option for Via Fill Applications
With the increased use of High Density Interconnects in printed wiring boards (PWB) there is a critical need for reliable methods to completely fill through hole and blind vias. Complete fillin
.. read more
Characterization of Acid Copper Plating Solution for Via-Filling
The use of acid copper plating process for via-filling effectively forms interlayer connection in build-up PWBs with
high-density interconnections. However,in the case of copper film deposited
.. read more