Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Evaluation,Selection and Qualification of Replacement Reworkable Underfill Materials
A study was performed to investigate,evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs),Leadless SMT devices,QFNs,connectors and passive d
.. read more
Defect Features Detected by Acoustic Emission for Flip-Chip CGA/FCBGA/PBGA/FPGBA Packages and Assemblies
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “a
.. read more
Evaluation,Selection and Qualification of Replacement Reworkable Underfill Materials
A study was performed to investigate,evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs),Leadless SMT devices,QFNs,connectors and passive d
.. read more
Defect Features Detected by Acoustic Emission for Flip-Chip CGA/FCBGA/PBGA/FPGBA Packages and Assemblies
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “a
.. read more