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Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins
An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame
retardant epoxy resins use bromine-containing flame-retardants. In t
.. read more
Processing High Density Interconnects: Selecting the Best Option for Via Fill Applications
With the increased use of High Density Interconnects in printed wiring boards (PWB) there is a critical need for reliable methods to completely fill through hole and blind vias. Complete fillin
.. read more
Optimizing Immersion Silver Chemistries for Copper
Immersion silver chemistry has been promoted as a final finish for solderability for several years now. There are different commercially available products that will deposit silver in a wide ra
.. read more
Characterization of Acid Copper Plating Solution for Via-Filling
The use of acid copper plating process for via-filling effectively forms interlayer connection in build-up PWBs with
high-density interconnections. However,in the case of copper film deposited
.. read more
Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins
An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame
retardant epoxy resins use bromine-containing flame-retardants. In t
.. read more
Processing High Density Interconnects: Selecting the Best Option for Via Fill Applications
With the increased use of High Density Interconnects in printed wiring boards (PWB) there is a critical need for reliable methods to completely fill through hole and blind vias. Complete fillin
.. read more
Optimizing Immersion Silver Chemistries for Copper
Immersion silver chemistry has been promoted as a final finish for solderability for several years now. There are different commercially available products that will deposit silver in a wide ra
.. read more
Characterization of Acid Copper Plating Solution for Via-Filling
The use of acid copper plating process for via-filling effectively forms interlayer connection in build-up PWBs with
high-density interconnections. However,in the case of copper film deposited
.. read more