Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Conformal Coating over No Clean Flux
As the proliferation of modern day electronics continues to drive miniaturization and functionality,electronic designers/assemblers face the issue of environmental exposure and uncommon applica
.. read more
Effect of Plasma Surface Treatment for Peel Strength of Metallization Based on Polyimide
The purpose of this study is to investigate the optimum plasma processing as a pre-treatment for the surface of Polyimide (PI) in order to increase adhesion strength of electroless copper (Cu)
.. read more
Thermal Expansion of Silicones in Electronic Reliability
CTE mismatches during temperature cycling can cause significant movement of components and materials relative to one
another,which in turn stresses solder joints and wirebonds. Silicones are of
.. read more
Low Temperature Characteristics of Silicones
Silicones are often used to protect electronic applications designed for cold environments. The low temperature flexibility
of silicones is well recognized,but not as well understood. While the
.. read more
Parylene as a Suppressant for Tin Whiskers Growth on Printed Circuit Boards
With the implementation of RoHS directives,pure tin plating is replacing lead in the tin-alloy used in the printed circuit boards and other worldwide electronics. Although use of tin provides a
.. read more
The Development of Dry Film Photoresist with 15um Lines and Spaces Resolution for Semi-Additive Processing
Next generation IC substrate designs will feature higher interconnect density and faster signal speed than current designs.
Circuitization of these substrates uses copper pattern plating follow
.. read more
Flexible PCB Plating Through Hole Considerations,Experiences and Solutions
Due to the worldwide increase in demand for flex and flex-rigid panels as well as the shift in the required designs of panels
there is an extreme need for improved PTH processing. There are sev
.. read more
High Frequency Conductor Loss Impact of Oxide and Oxide Alternative Processes
In most of today's high speed digital interconnects,the signal loss associated with the printed circuit board (PCB) is the
dominate factor. Material selection,trace geometry,and choice of coppe
.. read more
Method for Determining the Adhesion of Reflow Encapsulant Attached Components
A simple and cost effective method has been developed in order to test adhesion of components to a circuit board
via a reflow encapsulant. Originally,a mechanical shock test similar to current
.. read more
Adhesiveless Copper on Polyimide Substrate with Nickel-Chromium Tiecoat
Adhesiveless copper on polyimide substrates are used extensively for high density,flexible circuit applications. A
typical construction includes the polyimide substrate,a thin vacuum deposited
.. read more
Conformal Coating over No Clean Flux
As the proliferation of modern day electronics continues to drive miniaturization and functionality,electronic designers/assemblers face the issue of environmental exposure and uncommon applica
.. read more
Effect of Plasma Surface Treatment for Peel Strength of Metallization Based on Polyimide
The purpose of this study is to investigate the optimum plasma processing as a pre-treatment for the surface of Polyimide (PI) in order to increase adhesion strength of electroless copper (Cu)
.. read more
Thermal Expansion of Silicones in Electronic Reliability
CTE mismatches during temperature cycling can cause significant movement of components and materials relative to one
another,which in turn stresses solder joints and wirebonds. Silicones are of
.. read more
Low Temperature Characteristics of Silicones
Silicones are often used to protect electronic applications designed for cold environments. The low temperature flexibility
of silicones is well recognized,but not as well understood. While the
.. read more
Parylene as a Suppressant for Tin Whiskers Growth on Printed Circuit Boards
With the implementation of RoHS directives,pure tin plating is replacing lead in the tin-alloy used in the printed circuit boards and other worldwide electronics. Although use of tin provides a
.. read more
The Development of Dry Film Photoresist with 15um Lines and Spaces Resolution for Semi-Additive Processing
Next generation IC substrate designs will feature higher interconnect density and faster signal speed than current designs.
Circuitization of these substrates uses copper pattern plating follow
.. read more
Flexible PCB Plating Through Hole Considerations,Experiences and Solutions
Due to the worldwide increase in demand for flex and flex-rigid panels as well as the shift in the required designs of panels
there is an extreme need for improved PTH processing. There are sev
.. read more
High Frequency Conductor Loss Impact of Oxide and Oxide Alternative Processes
In most of today's high speed digital interconnects,the signal loss associated with the printed circuit board (PCB) is the
dominate factor. Material selection,trace geometry,and choice of coppe
.. read more
Method for Determining the Adhesion of Reflow Encapsulant Attached Components
A simple and cost effective method has been developed in order to test adhesion of components to a circuit board
via a reflow encapsulant. Originally,a mechanical shock test similar to current
.. read more
Adhesiveless Copper on Polyimide Substrate with Nickel-Chromium Tiecoat
Adhesiveless copper on polyimide substrates are used extensively for high density,flexible circuit applications. A
typical construction includes the polyimide substrate,a thin vacuum deposited
.. read more