Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Study of Various PCBA Surface Finishes
In this study various printed circuit board surface finishes were evaluated,including: organic solderability preservative (OSP),plasma finish (PF),immersion silver (IAg),electroless nickel / im
.. read more
Influence of Microstructure on Mechanical Behavior of Bi-Containing Pb-Free Solders
SAC-Bi and Sn-Ag-Bi alloys have demonstrated superior performance in thermal cycling reliability tests of printed circuit boards,such as the National Center for Manufacturing Sciences programs
.. read more
High Melting Lead-Free Mixed Biagx Solder Paste System
Although lead-free soldering has been main stream in the industry since 2006,with the replacement of eutectic SnPb system by the Sn/Ag/Cu system,the development of drop-in lead-free alternative
.. read more
Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability
SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements
.. read more
Embedded Passives Predictability,As-Received and In-Service
Embedded resistors and capacitors provide high-density high-performance solutions,freeing up the surface for other
components and enabling tailored interconnect topology. This technology needs
.. read more
Performance of Photoimageable Solder Masks – A Study on Thermal Stress
The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula
.. read more
Microstructure and Properties of Sn-Pb Solder Joints with Sn-Bi Finished Components
For this study,researchers from the University of Toronto produced samples of Sn-Pb solder,with additions of bismuth,
solidified at controlled cooling rates. The microstructure of the various B
.. read more
Wetting of Fresh and Aged Immersion Tin and Silver Surface Finishes by Sn/Ag/Cu Solder
The wetting of alternative PCB surface finishes,including immersion silver (I-Ag) and immersion tin (I-Sn),by
Sn/Ag/Cu solder and Sn/Pb solder,was studied in this work,along with electroless ni
.. read more
Electroplating and Properties of Lead-Free Finishes
Tin alloys such as Sn 0.7% Cu and Sn 2%Bi were identified as a viable alternative to tin-lead finish. Electroplating
of these alloys is challenging because of great difference in reduction pote
.. read more
Study of Various PCBA Surface Finishes
In this study various printed circuit board surface finishes were evaluated,including: organic solderability preservative (OSP),plasma finish (PF),immersion silver (IAg),electroless nickel / im
.. read more
Influence of Microstructure on Mechanical Behavior of Bi-Containing Pb-Free Solders
SAC-Bi and Sn-Ag-Bi alloys have demonstrated superior performance in thermal cycling reliability tests of printed circuit boards,such as the National Center for Manufacturing Sciences programs
.. read more
High Melting Lead-Free Mixed Biagx Solder Paste System
Although lead-free soldering has been main stream in the industry since 2006,with the replacement of eutectic SnPb system by the Sn/Ag/Cu system,the development of drop-in lead-free alternative
.. read more
Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability
SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements
.. read more
Embedded Passives Predictability,As-Received and In-Service
Embedded resistors and capacitors provide high-density high-performance solutions,freeing up the surface for other
components and enabling tailored interconnect topology. This technology needs
.. read more
Performance of Photoimageable Solder Masks – A Study on Thermal Stress
The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula
.. read more
Microstructure and Properties of Sn-Pb Solder Joints with Sn-Bi Finished Components
For this study,researchers from the University of Toronto produced samples of Sn-Pb solder,with additions of bismuth,
solidified at controlled cooling rates. The microstructure of the various B
.. read more
Wetting of Fresh and Aged Immersion Tin and Silver Surface Finishes by Sn/Ag/Cu Solder
The wetting of alternative PCB surface finishes,including immersion silver (I-Ag) and immersion tin (I-Sn),by
Sn/Ag/Cu solder and Sn/Pb solder,was studied in this work,along with electroless ni
.. read more
Electroplating and Properties of Lead-Free Finishes
Tin alloys such as Sn 0.7% Cu and Sn 2%Bi were identified as a viable alternative to tin-lead finish. Electroplating
of these alloys is challenging because of great difference in reduction pote
.. read more