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Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Third Report: Comparison of Four Low-Silver Sphere Alloys and...
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more
Lead Free and Other Process Effects on Conductive Anodic Filamentation Resistance of Glass Reinforced Epoxy Laminates
Conductive Anodic Filamentation is a subsurface failure mode for woven glass reinforced laminates (FR4) materials,where a
copper salt filament allows bridging between via walls or other copper
.. read more
Standization Effort in Japan in the Area of Optoelectronic Assembly Technology
We have organized in JPCA a committee for the standardization of optoelectronic assembly technology in
collaboration with JIEP (Japan Institute of Electronics Packaging) with cooperation of JEI
.. read more
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Third Report: Comparison of Four Low-Silver Sphere Alloys and...
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more
Lead Free and Other Process Effects on Conductive Anodic Filamentation Resistance of Glass Reinforced Epoxy Laminates
Conductive Anodic Filamentation is a subsurface failure mode for woven glass reinforced laminates (FR4) materials,where a
copper salt filament allows bridging between via walls or other copper
.. read more
Standization Effort in Japan in the Area of Optoelectronic Assembly Technology
We have organized in JPCA a committee for the standardization of optoelectronic assembly technology in
collaboration with JIEP (Japan Institute of Electronics Packaging) with cooperation of JEI
.. read more