Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Active Alignment Adhesive Technology
The assembly of complex optical systems such as objective lenses for smartphone cameras, autonomous driving sensors / cameras, and light detection and ranging (LiDAR) require precise alignme
.. read more
Study of SMT Assembly Processes for Fine Pitch CSP Packages
The SMT (surface mount technology) assembly process for 0.4 mm pitch CSP (chip scale package) components was studied
in this work. For the screen printing process,the printing performance of di
.. read more
Flip Chip Connections Using Bumps,Wells,and Imprinting
A conceptual framework for a new type of flip chip attachment is proposed. Gold stud bumps are provided on the chips,and
wells filled with solder paste are provided on a flexible substrate serv
.. read more
Active Alignment Adhesive Technology
The assembly of complex optical systems such as objective lenses for smartphone cameras, autonomous driving sensors / cameras, and light detection and ranging (LiDAR) require precise alignme
.. read more
Study of SMT Assembly Processes for Fine Pitch CSP Packages
The SMT (surface mount technology) assembly process for 0.4 mm pitch CSP (chip scale package) components was studied
in this work. For the screen printing process,the printing performance of di
.. read more
Flip Chip Connections Using Bumps,Wells,and Imprinting
A conceptual framework for a new type of flip chip attachment is proposed. Gold stud bumps are provided on the chips,and
wells filled with solder paste are provided on a flexible substrate serv
.. read more