Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Use of Novel Adhesive-lined CCL Material in Single-pressed Multi-layer Circuit Boards with Inner Via-Holes in all Layers
This newly developed material and process enable the manufacturing,using a single pressing process,of multi-layer circuit
boards with inner via-holes in every layer. Because this material utili
.. read more
All Polyimide Thin Multi-Layer Substrate
As a promising candidate for future substrate with high pin-count and low transmission loss at high frequency,we have
developed an all polyimide multi-layered board laminated by single batch pr
.. read more
Use of Novel Adhesive-lined CCL Material in Single-pressed Multi-layer Circuit Boards with Inner Via-Holes in all Layers
This newly developed material and process enable the manufacturing,using a single pressing process,of multi-layer circuit
boards with inner via-holes in every layer. Because this material utili
.. read more
All Polyimide Thin Multi-Layer Substrate
As a promising candidate for future substrate with high pin-count and low transmission loss at high frequency,we have
developed an all polyimide multi-layered board laminated by single batch pr
.. read more