Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Effect of BGA Reballing and its Influence on Ball Shear Strength
As more components are becoming lead free and not available in the tin lead alloy,there is an industry wide interest when it comes to the reballing and the subsequent effects it has on the stre
.. read more
Investigating the 01005-Component Assembly Process Requirements
In 2006 we conducted two formal detailed experiments on the 01005-component assembly process. Two of the most significant findings from those experiments were that a 0.003” thick stencil is req
.. read more
Effect of BGA Reballing and its Influence on Ball Shear Strength
As more components are becoming lead free and not available in the tin lead alloy,there is an industry wide interest when it comes to the reballing and the subsequent effects it has on the stre
.. read more
Investigating the 01005-Component Assembly Process Requirements
In 2006 we conducted two formal detailed experiments on the 01005-component assembly process. Two of the most significant findings from those experiments were that a 0.003” thick stencil is req
.. read more