Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Recrystallisation and the Resulting Crystal Structures in Plated Microvias
Plated and filled microvias are a common feature in modern PCBs, so much so, that they are now considered as the industry norm as a means of achieving high-density designs for modern mobile
.. read more
iNEMI Recommendations on Lead Free Finishes for Components Used in High-Reliability Products
This document is intended to help manufacturers minimize the risk of failures from tin whiskers. It is the consensus of the
iNEMI User Group that pure tin electroplating presents a risk in high
.. read more
Characterization of Acid Copper Plating Solution for Via-Filling
The use of acid copper plating process for via-filling effectively forms interlayer connection in build-up PWBs with
high-density interconnections. However,in the case of copper film deposited
.. read more
Recrystallisation and the Resulting Crystal Structures in Plated Microvias
Plated and filled microvias are a common feature in modern PCBs, so much so, that they are now considered as the industry norm as a means of achieving high-density designs for modern mobile
.. read more
iNEMI Recommendations on Lead Free Finishes for Components Used in High-Reliability Products
This document is intended to help manufacturers minimize the risk of failures from tin whiskers. It is the consensus of the
iNEMI User Group that pure tin electroplating presents a risk in high
.. read more
Characterization of Acid Copper Plating Solution for Via-Filling
The use of acid copper plating process for via-filling effectively forms interlayer connection in build-up PWBs with
high-density interconnections. However,in the case of copper film deposited
.. read more