Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Effect of Alloy and Flux System on High Reliability Automotive Applications
The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later,all major OEM and Tier 1 automotive manufacturers have converted
.. read more
Wave Solder Process Optimization for Complex Electronic Assemblies: A Design of Experiments Approach
Numerous technical articles have dealt with machine parameters,and their effect on wave soldering of Printed Circuit Boards
in the range of 40-93 mils and the typical 6 to 8 layers. This resear
.. read more
Solder Paste Wetting and Solder-Balling Evaluation: A Quantitative Statistical Approach Using DOE
The ability of a solder paste particles to coalesce and wet the Printed Wiring Board (PWB) and component lead is
key to proper solder joint formation. Robust solder paste performance is needed
.. read more
Effect of Alloy and Flux System on High Reliability Automotive Applications
The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later,all major OEM and Tier 1 automotive manufacturers have converted
.. read more
Wave Solder Process Optimization for Complex Electronic Assemblies: A Design of Experiments Approach
Numerous technical articles have dealt with machine parameters,and their effect on wave soldering of Printed Circuit Boards
in the range of 40-93 mils and the typical 6 to 8 layers. This resear
.. read more
Solder Paste Wetting and Solder-Balling Evaluation: A Quantitative Statistical Approach Using DOE
The ability of a solder paste particles to coalesce and wet the Printed Wiring Board (PWB) and component lead is
key to proper solder joint formation. Robust solder paste performance is needed
.. read more