Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Printing and Assembly Challenges for QFN Devices
Although QFN devices present a challenge to the SMT assembly process with proper stencil design,proper stencil technology selection (Laser,Electroform,Nano-Coat),and proper PCB solder mask layo
.. read more
Quantitative Evaluation of New SMT Stencil Materials
High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase,so do the challenges of maintaining a successfu
.. read more
Stencil Options for Printing Solder Paste for .3 Mm CSP’s and 01005 Chip Components
Printing solder paste for very small components like .3mm pitch CSP’s and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields,SMT Connecto
.. read more
Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly
The advent of miniaturized electronics for mobile phones and other portable devices has required the assembly of smaller and smaller components. Currently 01005 passives and 0.3 mm CSPs are som
.. read more
Investigating the 01005-Component Assembly Process Requirements
In 2006 we conducted two formal detailed experiments on the 01005-component assembly process. Two of the most significant findings from those experiments were that a 0.003” thick stencil is req
.. read more
The Graping Phenomenon: Improving Pb-Free Solder Coalescence through Process and Material Optimization
As small surface-mount components such as 0201 and 01005 packages have entered volume assembly,manufacturers are observing increased instances of poor solder coalescence during reflow. The root
.. read more
Determining Area Ratio Rule for Type 4 and Type 5 Solder Paste
Stencil design is one of the key factors in determining how well any particular stencil will print solder paste. Today’s high volume,24 hour a day,seven days a week manufacturing operations req
.. read more
Investigation into the Mass Imaging aspects of 0.3mm Wafer Level Chip Scale Package solder paste deposition
fast approaching this horizon is the 0.3mm CSP. This device represents a major assembly revolution within the Surface mount assembly (SMT) arena. The implementation of this device will require
.. read more
Lead Free 0201 Assembly and Thermal Cycle/Aging Reliability
The many challenges with 0201 passive component assembly can be attributed to the solder paste volume,pad design,
aperture design,board finish,type of solder paste,pick-and-place,and reflow pro
.. read more
Bumping BGA’s Using Solder Paste Printing Process for RFI Shields Packaging
One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies
consists of “snapping” the shell-like shields onto solder spheres that are
.. read more
Stencil Design and Performance for Flip Chip/Wafer Bumping
There has been much recent interest in printing solder paste onto UBM pads of a wafer. Usually the wafer pad is overprinted
using a stencil aperture that is larger than the wafer pad. This perm
.. read more
Print Process Characterization for Fine Pitch Area Array Packages using Taguchi Techniques
The trend in electronics packaging towards product miniaturization,has forced the industry to use fine pitch area
array packages instead of fine pitch leaded packages. These area array packages
.. read more
Printing and Assembly Challenges for QFN Devices
Although QFN devices present a challenge to the SMT assembly process with proper stencil design,proper stencil technology selection (Laser,Electroform,Nano-Coat),and proper PCB solder mask layo
.. read more
Quantitative Evaluation of New SMT Stencil Materials
High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase,so do the challenges of maintaining a successfu
.. read more
Stencil Options for Printing Solder Paste for .3 Mm CSP’s and 01005 Chip Components
Printing solder paste for very small components like .3mm pitch CSP’s and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields,SMT Connecto
.. read more
Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly
The advent of miniaturized electronics for mobile phones and other portable devices has required the assembly of smaller and smaller components. Currently 01005 passives and 0.3 mm CSPs are som
.. read more
Investigating the 01005-Component Assembly Process Requirements
In 2006 we conducted two formal detailed experiments on the 01005-component assembly process. Two of the most significant findings from those experiments were that a 0.003” thick stencil is req
.. read more
The Graping Phenomenon: Improving Pb-Free Solder Coalescence through Process and Material Optimization
As small surface-mount components such as 0201 and 01005 packages have entered volume assembly,manufacturers are observing increased instances of poor solder coalescence during reflow. The root
.. read more
Determining Area Ratio Rule for Type 4 and Type 5 Solder Paste
Stencil design is one of the key factors in determining how well any particular stencil will print solder paste. Today’s high volume,24 hour a day,seven days a week manufacturing operations req
.. read more
Investigation into the Mass Imaging aspects of 0.3mm Wafer Level Chip Scale Package solder paste deposition
fast approaching this horizon is the 0.3mm CSP. This device represents a major assembly revolution within the Surface mount assembly (SMT) arena. The implementation of this device will require
.. read more
Lead Free 0201 Assembly and Thermal Cycle/Aging Reliability
The many challenges with 0201 passive component assembly can be attributed to the solder paste volume,pad design,
aperture design,board finish,type of solder paste,pick-and-place,and reflow pro
.. read more
Bumping BGA’s Using Solder Paste Printing Process for RFI Shields Packaging
One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies
consists of “snapping” the shell-like shields onto solder spheres that are
.. read more
Stencil Design and Performance for Flip Chip/Wafer Bumping
There has been much recent interest in printing solder paste onto UBM pads of a wafer. Usually the wafer pad is overprinted
using a stencil aperture that is larger than the wafer pad. This perm
.. read more
Print Process Characterization for Fine Pitch Area Array Packages using Taguchi Techniques
The trend in electronics packaging towards product miniaturization,has forced the industry to use fine pitch area
array packages instead of fine pitch leaded packages. These area array packages
.. read more