Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice
As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage,
.. read more
Microvia Weak Interfacial Fracture of Microvia Designs-Comparing the Reliability of Graphite-based Direct Metallization and Conventional Electroless Copper-Phase 1
Documentation shows that there are latent reliability issues with stacked filled Microvia designs for complex printed circuit boards. This issue is broadly defined as a weak interface betwee
.. read more
Unlocking the Mystery of Aperture Architecture for Fine Line Printing
The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However,the impending introduction of passive Metric 0201 devices h
.. read more
Effects of Dielectric Material,Aspect Ratio and Copper Plating on Microvia Reliability
This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets of experiments were carried out to evaluate the effects of dielectric material,asp
.. read more
PCB Design Principles for QFN and Other Bottom Termination Components
Although many of the QFN and bottom termination products are small in outline and utilize a plastic encapsulated copper
lead-frame structure they do not resemble the more traditional small outl
.. read more
The Effect of Functional Pads and Pitch on Via Reliability using Thermal Cycling and Interconnect Stress Testing
European legislation has meant that lead-free solders now dominate mainstream electronics manufacturing. These
replacement solders are all high tin alloys with significantly higher melting poin
.. read more
Mechanically Drilled Controlled Depth Micro Vias an Alternative to Laser Drilling
As the requirements for controlled depth micro-vias become ever increasing in today’s market place the best feasible solution
appears to be laser drilling. However laser drilling can be problem
.. read more
An Analytical Analysis of the Fluid Mechanics Involved In PCB Plating
It has been the conventional wisdom of the industry that the predominate board parameter associated with through hole plating is the aspect ratio of the through hole. While this is intuitively
.. read more
Via (Plated Through Hole) Integrity with Lead Free Soldering
Bare printed wiring board materials require changes from today’s typical standard dicy cured FR4 materials in order to
support lead-free assembly. The High Density Packaging User’s Group has co
.. read more
Designing Embedded Resistors and Capacitors
Embedded passives,i.e.,resistors and capacitors built right into the printed circuit board substrate,is a rapidly emerging and
pivotal technology for the PCB industry preceded only by the plate
.. read more
Printing and Profiling Fine Feature Devices
To characterize the paste printing process,both the individual aspects of the process and the interactions between the
aspects must be understood. The main aspects of the printing process are p
.. read more
Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice
As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage,
.. read more
Microvia Weak Interfacial Fracture of Microvia Designs-Comparing the Reliability of Graphite-based Direct Metallization and Conventional Electroless Copper-Phase 1
Documentation shows that there are latent reliability issues with stacked filled Microvia designs for complex printed circuit boards. This issue is broadly defined as a weak interface betwee
.. read more
Unlocking the Mystery of Aperture Architecture for Fine Line Printing
The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However,the impending introduction of passive Metric 0201 devices h
.. read more
Effects of Dielectric Material,Aspect Ratio and Copper Plating on Microvia Reliability
This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets of experiments were carried out to evaluate the effects of dielectric material,asp
.. read more
PCB Design Principles for QFN and Other Bottom Termination Components
Although many of the QFN and bottom termination products are small in outline and utilize a plastic encapsulated copper
lead-frame structure they do not resemble the more traditional small outl
.. read more
The Effect of Functional Pads and Pitch on Via Reliability using Thermal Cycling and Interconnect Stress Testing
European legislation has meant that lead-free solders now dominate mainstream electronics manufacturing. These
replacement solders are all high tin alloys with significantly higher melting poin
.. read more
Mechanically Drilled Controlled Depth Micro Vias an Alternative to Laser Drilling
As the requirements for controlled depth micro-vias become ever increasing in today’s market place the best feasible solution
appears to be laser drilling. However laser drilling can be problem
.. read more
An Analytical Analysis of the Fluid Mechanics Involved In PCB Plating
It has been the conventional wisdom of the industry that the predominate board parameter associated with through hole plating is the aspect ratio of the through hole. While this is intuitively
.. read more
Via (Plated Through Hole) Integrity with Lead Free Soldering
Bare printed wiring board materials require changes from today’s typical standard dicy cured FR4 materials in order to
support lead-free assembly. The High Density Packaging User’s Group has co
.. read more
Designing Embedded Resistors and Capacitors
Embedded passives,i.e.,resistors and capacitors built right into the printed circuit board substrate,is a rapidly emerging and
pivotal technology for the PCB industry preceded only by the plate
.. read more
Printing and Profiling Fine Feature Devices
To characterize the paste printing process,both the individual aspects of the process and the interactions between the
aspects must be understood. The main aspects of the printing process are p
.. read more