Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Enig – Corrosion: The Status, The Risks and The Solutions
The ENIG finish is one of the most common final finishes finding broad acceptance in the market for decades. ENIG is the abbreviation for “electroless nickel – immersion gold” where it is th
.. read more
Comparing the Reliability Performance of Electroless Palladium and Autocatalytic Gold in Production Environment
The development of nano-scale surface finishes over copper pads such as Electroless Palladium and Autocatalytic Gold (EPAG) has been evolving in the recent years due to ever increasing deman
.. read more
ENEPIG -How the Process Characteristics Influence the Layer Performance
Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) is a well-accepted and established finish for high performance applications. The properties of the coating are determined mai
.. read more
Selective Electroless Nickel and Gold Plating of Individual Integrated Circuits for Thermocompression Gold Stud Bump Flip-Chip Attachment
Flip chip bonding is the most desirable direct chip attachment approach for minimizing electronic assembly size as well as
improving device performance. For most prototyping applications it is
.. read more
Enig – Corrosion: The Status, The Risks and The Solutions
The ENIG finish is one of the most common final finishes finding broad acceptance in the market for decades. ENIG is the abbreviation for “electroless nickel – immersion gold” where it is th
.. read more
Comparing the Reliability Performance of Electroless Palladium and Autocatalytic Gold in Production Environment
The development of nano-scale surface finishes over copper pads such as Electroless Palladium and Autocatalytic Gold (EPAG) has been evolving in the recent years due to ever increasing deman
.. read more
ENEPIG -How the Process Characteristics Influence the Layer Performance
Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) is a well-accepted and established finish for high performance applications. The properties of the coating are determined mai
.. read more
Selective Electroless Nickel and Gold Plating of Individual Integrated Circuits for Thermocompression Gold Stud Bump Flip-Chip Attachment
Flip chip bonding is the most desirable direct chip attachment approach for minimizing electronic assembly size as well as
improving device performance. For most prototyping applications it is
.. read more