Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Effects of BGA Rework on Board-Level Reliability
The research goal was to establish a limit for the number of rework cycles for Ball Gird Arrays (BGAs) and to determine the clearance required between a BGA and its surrounding components on
.. read more
AXI Voiding Detection on High Power Transistor
High Power Transistors contain materials and structure that pose unique challenges to AXI technologies. The work discusses traditional AXI imaging and processing techniques and their limitation
.. read more
Characterization of Solder Defects in Package on Packages with AXI Systems for Inspection Quality Improvement
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls,we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-C
.. read more
Head in Pillow X-ray Inspection at Flextronics
Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critica
.. read more
TDI Imaging: An Efficient AOI and AXI Tool
As a result of heightened requirements for quality,integrity and reliability of electronic products,the role of wafer auditing
and nondestructive testing of printed circuit boards and electroni
.. read more
Benefits and Limitations of Universal,low-pin count Automated Test Equipment for Printed Circuit Assemblies
This paper discusses the benefits and limitations of universal,low-pin count Automated Test Equipment for Printed Circuit
Assembly (PCA) testing utilizing the test access port (TAP) defined in
.. read more
Changing the Paradigm For Optical and X-Ray Inspection of Backplanes and Large PCB Assemblies
Fully automatic X-ray Inspection (AXI) is an established technique for inspecting component mounting and solder joint integrity on PCBA’s. It is occasionally used for the detection of faults on
.. read more
Results from 2007 Industry Defect Level and Test Effectiveness Studies
To select an optimal test strategy,good knowledge of defect levels and test effectiveness are two very important factors to include. In 1999 an industry defect level study was completed and was
.. read more
Improving SMT Yield with AOI and AXI Test Results Analysis
As printed circuit board assembly (PCBA) becomes more complex,Automatic Optical Inspection (AOI) and Automatic Xray Inspection (AXI) systems are becoming more widely used in electronics manufac
.. read more
The Utilization of X-ray to Effectively Test Quad Flat No-Lead Packages
The Quad Flat No-Lead or QFN packages are increasing in their utilization in the printed circuit board market. This is being driven largely by the shrinking size both in profile and footprint,h
.. read more
Test and Inspection of Lead-Free Assemblies
Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes.
While some companies are taking advantage of the situation and are us
.. read more
Paste Inspection Study
Many papers and articles are claiming that a majority of the defects detected after reflow are coming from the solder paste application process. However,very little real data seems to be availa
.. read more
AOI/AXI Combinational Inspection Strategy
The purpose of this study is to understand the capability of both AOI and AXI machines and where the two could be combined to increase the inspection coverage,reduce the overall cycle time of t
.. read more
Effects of BGA Rework on Board-Level Reliability
The research goal was to establish a limit for the number of rework cycles for Ball Gird Arrays (BGAs) and to determine the clearance required between a BGA and its surrounding components on
.. read more
AXI Voiding Detection on High Power Transistor
High Power Transistors contain materials and structure that pose unique challenges to AXI technologies. The work discusses traditional AXI imaging and processing techniques and their limitation
.. read more
Characterization of Solder Defects in Package on Packages with AXI Systems for Inspection Quality Improvement
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls,we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-C
.. read more
Head in Pillow X-ray Inspection at Flextronics
Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critica
.. read more
TDI Imaging: An Efficient AOI and AXI Tool
As a result of heightened requirements for quality,integrity and reliability of electronic products,the role of wafer auditing
and nondestructive testing of printed circuit boards and electroni
.. read more
Benefits and Limitations of Universal,low-pin count Automated Test Equipment for Printed Circuit Assemblies
This paper discusses the benefits and limitations of universal,low-pin count Automated Test Equipment for Printed Circuit
Assembly (PCA) testing utilizing the test access port (TAP) defined in
.. read more
Changing the Paradigm For Optical and X-Ray Inspection of Backplanes and Large PCB Assemblies
Fully automatic X-ray Inspection (AXI) is an established technique for inspecting component mounting and solder joint integrity on PCBA’s. It is occasionally used for the detection of faults on
.. read more
Results from 2007 Industry Defect Level and Test Effectiveness Studies
To select an optimal test strategy,good knowledge of defect levels and test effectiveness are two very important factors to include. In 1999 an industry defect level study was completed and was
.. read more
Improving SMT Yield with AOI and AXI Test Results Analysis
As printed circuit board assembly (PCBA) becomes more complex,Automatic Optical Inspection (AOI) and Automatic Xray Inspection (AXI) systems are becoming more widely used in electronics manufac
.. read more
The Utilization of X-ray to Effectively Test Quad Flat No-Lead Packages
The Quad Flat No-Lead or QFN packages are increasing in their utilization in the printed circuit board market. This is being driven largely by the shrinking size both in profile and footprint,h
.. read more
Test and Inspection of Lead-Free Assemblies
Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes.
While some companies are taking advantage of the situation and are us
.. read more
Paste Inspection Study
Many papers and articles are claiming that a majority of the defects detected after reflow are coming from the solder paste application process. However,very little real data seems to be availa
.. read more
AOI/AXI Combinational Inspection Strategy
The purpose of this study is to understand the capability of both AOI and AXI machines and where the two could be combined to increase the inspection coverage,reduce the overall cycle time of t
.. read more