Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Design for Testability (DFT) to Overcome Functional Board Test Complexities in Manufacturing Test
Manufacturers test to ensure that the product is built correctly. Shorts,opens,wrong or incorrectly inserted components,even catastrophically faulty components need to be flagged,found and repa
.. read more
Characterization of Solder Defects in Package on Packages with AXI Systems for Inspection Quality Improvement
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls,we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-C
.. read more
Head in Pillow X-ray Inspection at Flextronics
Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critica
.. read more
TDI Imaging: An Efficient AOI and AXI Tool
As a result of heightened requirements for quality,integrity and reliability of electronic products,the role of wafer auditing
and nondestructive testing of printed circuit boards and electroni
.. read more
Benefits and Limitations of Universal,low-pin count Automated Test Equipment for Printed Circuit Assemblies
This paper discusses the benefits and limitations of universal,low-pin count Automated Test Equipment for Printed Circuit
Assembly (PCA) testing utilizing the test access port (TAP) defined in
.. read more
Changing the Paradigm For Optical and X-Ray Inspection of Backplanes and Large PCB Assemblies
Fully automatic X-ray Inspection (AXI) is an established technique for inspecting component mounting and solder joint integrity on PCBA’s. It is occasionally used for the detection of faults on
.. read more
Improving SMT Yield with AOI and AXI Test Results Analysis
As printed circuit board assembly (PCBA) becomes more complex,Automatic Optical Inspection (AOI) and Automatic Xray Inspection (AXI) systems are becoming more widely used in electronics manufac
.. read more
The Utilization of X-ray to Effectively Test Quad Flat No-Lead Packages
The Quad Flat No-Lead or QFN packages are increasing in their utilization in the printed circuit board market. This is being driven largely by the shrinking size both in profile and footprint,h
.. read more
What to Consider when Designing a Universal Test Strategy Tool
Selecting an optimal test strategy is a complex task today. There are many test inspection and test methods available. The
most common choices to find manufacturing defects on printed circuit b
.. read more
Test and Inspection as Part of the Lead-Free Manufacturing Process
The paper will address issues that will impact defect levels and defect spectrum during the transition to lead-free
manufacturing. Since there are exemptions of which product types are mandated
.. read more
Test and Inspection of Lead-Free Assemblies
Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes.
While some companies are taking advantage of the situation and are us
.. read more
Paste Inspection Study
Many papers and articles are claiming that a majority of the defects detected after reflow are coming from the solder paste application process. However,very little real data seems to be availa
.. read more
Design for Testability (DFT) to Overcome Functional Board Test Complexities in Manufacturing Test
Manufacturers test to ensure that the product is built correctly. Shorts,opens,wrong or incorrectly inserted components,even catastrophically faulty components need to be flagged,found and repa
.. read more
Characterization of Solder Defects in Package on Packages with AXI Systems for Inspection Quality Improvement
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls,we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-C
.. read more
Head in Pillow X-ray Inspection at Flextronics
Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critica
.. read more
TDI Imaging: An Efficient AOI and AXI Tool
As a result of heightened requirements for quality,integrity and reliability of electronic products,the role of wafer auditing
and nondestructive testing of printed circuit boards and electroni
.. read more
Benefits and Limitations of Universal,low-pin count Automated Test Equipment for Printed Circuit Assemblies
This paper discusses the benefits and limitations of universal,low-pin count Automated Test Equipment for Printed Circuit
Assembly (PCA) testing utilizing the test access port (TAP) defined in
.. read more
Changing the Paradigm For Optical and X-Ray Inspection of Backplanes and Large PCB Assemblies
Fully automatic X-ray Inspection (AXI) is an established technique for inspecting component mounting and solder joint integrity on PCBA’s. It is occasionally used for the detection of faults on
.. read more
Improving SMT Yield with AOI and AXI Test Results Analysis
As printed circuit board assembly (PCBA) becomes more complex,Automatic Optical Inspection (AOI) and Automatic Xray Inspection (AXI) systems are becoming more widely used in electronics manufac
.. read more
The Utilization of X-ray to Effectively Test Quad Flat No-Lead Packages
The Quad Flat No-Lead or QFN packages are increasing in their utilization in the printed circuit board market. This is being driven largely by the shrinking size both in profile and footprint,h
.. read more
What to Consider when Designing a Universal Test Strategy Tool
Selecting an optimal test strategy is a complex task today. There are many test inspection and test methods available. The
most common choices to find manufacturing defects on printed circuit b
.. read more
Test and Inspection as Part of the Lead-Free Manufacturing Process
The paper will address issues that will impact defect levels and defect spectrum during the transition to lead-free
manufacturing. Since there are exemptions of which product types are mandated
.. read more
Test and Inspection of Lead-Free Assemblies
Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes.
While some companies are taking advantage of the situation and are us
.. read more
Paste Inspection Study
Many papers and articles are claiming that a majority of the defects detected after reflow are coming from the solder paste application process. However,very little real data seems to be availa
.. read more