Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Backdrill Under BGAHigh Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate dielectric conditions impacting the reliability of backdrilling escape vias under BGA via arrays. Large BGA si
.. read more
PCB Reliability Evaluation for 0.92 mm Pitch Field Programmable Gate Array (FPGA) Applications
Field Programmable Gate Arrays (FPGA) allow customers the flexibility to configure devices after they have been manufactured. The demand for higher speed requires higher pin counts to provid
.. read more
Influence of Via Stub Length and Antipad Size on the Insertion Loss Profile
The growing transmission speed and volume of digital content increases the pressure on reduction of overall insertion loss of printed circuit boards permanently.
In today’s circuit boards,it is
.. read more
Backdrilling Technology for Backpanel
In order to get excellent signal Integrity,half PTH holes will be a new trend in high frequency backpanel designing.
Backdrilling is necessary for this application. This paper explores the appl
.. read more
Backdrill Under BGAHigh Density Packaging User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate dielectric conditions impacting the reliability of backdrilling escape vias under BGA via arrays. Large BGA si
.. read more
PCB Reliability Evaluation for 0.92 mm Pitch Field Programmable Gate Array (FPGA) Applications
Field Programmable Gate Arrays (FPGA) allow customers the flexibility to configure devices after they have been manufactured. The demand for higher speed requires higher pin counts to provid
.. read more
Influence of Via Stub Length and Antipad Size on the Insertion Loss Profile
The growing transmission speed and volume of digital content increases the pressure on reduction of overall insertion loss of printed circuit boards permanently.
In today’s circuit boards,it is
.. read more
Backdrilling Technology for Backpanel
In order to get excellent signal Integrity,half PTH holes will be a new trend in high frequency backpanel designing.
Backdrilling is necessary for this application. This paper explores the appl
.. read more