Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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HALT Testing of Backward Soldered BGAs on a Military Product
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder bal
.. read more
Challenges in Reflow Profiling Large and High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes
Backward Compatibility of Pb free SnAgCu (SAC) solders with conventional SnPb soldering has been a subject of considerable interest since the introduction of Pb free solders earlier in this dec
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. read more
Lead Free Soldering and Environmental Compliance: Supply Chain Readiness & Challenges
Supply chain readiness and compatibility are critical to a smooth transition to environmental compliance for the worldwide
electronics industry. This paper reviews the status of Lead Free solde
.. read more
Backward Compatibility Study of Lead Free Area Array Packages with Tin-Lead Soldering Process
In response to RoHS and other international environmental legislation,the semiconductor industry is moving toward the
elimination of lead (Pb) from packages. During the transitional period,both
.. read more
HALT Testing of Backward Soldered BGAs on a Military Product
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder bal
.. read more
Challenges in Reflow Profiling Large and High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes
Backward Compatibility of Pb free SnAgCu (SAC) solders with conventional SnPb soldering has been a subject of considerable interest since the introduction of Pb free solders earlier in this dec
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. read more
Lead Free Soldering and Environmental Compliance: Supply Chain Readiness & Challenges
Supply chain readiness and compatibility are critical to a smooth transition to environmental compliance for the worldwide
electronics industry. This paper reviews the status of Lead Free solde
.. read more
Backward Compatibility Study of Lead Free Area Array Packages with Tin-Lead Soldering Process
In response to RoHS and other international environmental legislation,the semiconductor industry is moving toward the
elimination of lead (Pb) from packages. During the transitional period,both
.. read more