Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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New Cleaning Agent Designs for Removing No-Clean Lead-Free Flux Residues

The process cleaning rate theorem holds that the static rate (chemical forces) plus the dynamic cleaning rate (mechanical forces) equals the process cleaning rate. New lead-free flux residues r .. read more

Water Vapor Uptake and Release in Printed Boards

Excessive moisture entrapped/absorbed within printed board laminates can expand during soldering operations,causing delamination or other damage. While moisture absorption data is available for .. read more

MSL Rating and Packaging Requirements of PCBs used in Board Mounted Power Assemblies

In recent years there has been an increasing emphasis on miniaturization of Board Mount Power (BMP) modules and electronic subassemblies. In addition there has been a shift from predominately t .. read more

New Cleaning Agent Designs for Removing No-Clean Lead-Free Flux Residues

The process cleaning rate theorem holds that the static rate (chemical forces) plus the dynamic cleaning rate (mechanical forces) equals the process cleaning rate. New lead-free flux residues r .. read more

Water Vapor Uptake and Release in Printed Boards

Excessive moisture entrapped/absorbed within printed board laminates can expand during soldering operations,causing delamination or other damage. While moisture absorption data is available for .. read more

MSL Rating and Packaging Requirements of PCBs used in Board Mounted Power Assemblies

In recent years there has been an increasing emphasis on miniaturization of Board Mount Power (BMP) modules and electronic subassemblies. In addition there has been a shift from predominately t .. read more