Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
This paper presents lead-free ball grid array (BGA) packages subjected to two ball removal and two ball attachment techniques. Solder attach strength is used as a metric to examine the reballin
.. read more
3-D Packaging: Innovative Solutions for Multiple Die Applications
A vertically configured package technology developed by Tessera is proving to be a practical multi-die solution for any
number of single and multiple functional combinations. The enabling techn
.. read more
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
This paper presents lead-free ball grid array (BGA) packages subjected to two ball removal and two ball attachment techniques. Solder attach strength is used as a metric to examine the reballin
.. read more
3-D Packaging: Innovative Solutions for Multiple Die Applications
A vertically configured package technology developed by Tessera is proving to be a practical multi-die solution for any
number of single and multiple functional combinations. The enabling techn
.. read more