Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Impact of Assembly Cycles on Copper Wrap Plating
The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predic
.. read more
Design and Construction Affects on PWB Reliability
The reliability,as tested by thermal cycling,of printed wire boards (PWB) are established by three variables; copper quality,material robustness and design. The copper quality was most influent
.. read more
Microvia Reliability Failure Modes
Recent increases in assembly temperatures in response to removing lead from solder used in printed circuit boards (PCBs)
assembly has increase the strain and stress on interconnect structures.
.. read more
Impact of Assembly Cycles on Copper Wrap Plating
The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predic
.. read more
Design and Construction Affects on PWB Reliability
The reliability,as tested by thermal cycling,of printed wire boards (PWB) are established by three variables; copper quality,material robustness and design. The copper quality was most influent
.. read more
Microvia Reliability Failure Modes
Recent increases in assembly temperatures in response to removing lead from solder used in printed circuit boards (PCBs)
assembly has increase the strain and stress on interconnect structures.
.. read more