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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A DOE to assess PCB fabrication material design and process using IST (Interconnect Stress Testing) to improve fine pitch BGA...
During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer
.. read more
Experimental and Numerical Assessment of Plated Via Reliability
This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing
or observed during manufacturing. Finite element models have been developed
.. read more
A DOE to assess PCB fabrication material design and process using IST (Interconnect Stress Testing) to improve fine pitch BGA...
During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer
.. read more
Experimental and Numerical Assessment of Plated Via Reliability
This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing
or observed during manufacturing. Finite element models have been developed
.. read more