Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Advanced Through-Hole Rework of Thermally Challenging Components/Assemblies: An Evolutionary Process
Although the vast majority of electronic equipment has made the transition to lead-free without significant issue,some market segments still utilize tin-lead solder. The European Union’s RoHS l
.. read more
Pb-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs
As the use of lead-free alloys has increased in electronic assemblies,much work has been done to develop Design for Manufacturability (DFM) guidelines for the new materials. However,there are s
.. read more
Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering
The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad
.. read more
Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially
.. read more
A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability
Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f
.. read more
A Study of Implementing Lead free Soldering Process with Organic Solderability Preservative Coating In a High Volume Production Environment
As the global electronic industry marches toward the brave new world of environmentally conscious electronic manufacturing,lead free soldering has made some fundamental shifts in the processing
.. read more
Advanced Through-Hole Rework of Thermally Challenging Components/Assemblies: An Evolutionary Process
Although the vast majority of electronic equipment has made the transition to lead-free without significant issue,some market segments still utilize tin-lead solder. The European Union’s RoHS l
.. read more
Pb-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs
As the use of lead-free alloys has increased in electronic assemblies,much work has been done to develop Design for Manufacturability (DFM) guidelines for the new materials. However,there are s
.. read more
Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering
The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad
.. read more
Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially
.. read more
A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability
Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f
.. read more
A Study of Implementing Lead free Soldering Process with Organic Solderability Preservative Coating In a High Volume Production Environment
As the global electronic industry marches toward the brave new world of environmentally conscious electronic manufacturing,lead free soldering has made some fundamental shifts in the processing
.. read more