Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Development of High Density Wiring Technology and Interconnect Technology with Silicon Through-Hole
We have developed the copper high density wiring formation technology with Cu/photosensitive Benzocyclobutene (BCB) as
a dielectric material,and interconnect technology with Silicon through-hol
.. read more
Development of High Density and High Frequency Substrate Using B^2it Technology for Next Generation Packaging
For faster,smaller,and high performance integrated circuits the new concept of buried bump interconnect substrates is required. We have developed B2itTM (buried bump interconnection technology
.. read more
Development of High Density Wiring Technology and Interconnect Technology with Silicon Through-Hole
We have developed the copper high density wiring formation technology with Cu/photosensitive Benzocyclobutene (BCB) as
a dielectric material,and interconnect technology with Silicon through-hol
.. read more
Development of High Density and High Frequency Substrate Using B^2it Technology for Next Generation Packaging
For faster,smaller,and high performance integrated circuits the new concept of buried bump interconnect substrates is required. We have developed B2itTM (buried bump interconnection technology
.. read more