Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Methodology to Predict Mechanical Strength and Pad Cratering Failures under BGA Pads on Printed Circuit Boards
In the past few years,several papers,test methods and methodologies have been developed to estimate pad cratering under Ball Grid Array (BGA) pads in Printed Circuit Board Assemblies (PCBAs).
.. read more
Methodology to Predict Mechanical Strength and Pad Cratering Failures under BGA Pads on Printed Circuit Boards
In the past few years,several papers,test methods and methodologies have been developed to estimate pad cratering under Ball Grid Array (BGA) pads in Printed Circuit Board Assemblies (PCBAs).
.. read more