Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Effects of BGA Rework on Board-Level Reliability
The research goal was to establish a limit for the number of rework cycles for Ball Gird Arrays (BGAs) and to determine the clearance required between a BGA and its surrounding components on
.. read more
Non-Destructive BGA Rework Using Infrared Heating Technology
During the past few years, it has become increasingly difficult to physically rework printed circuit board (PCB) assemblies. Such mundane operations as soldering, desoldering and component r
.. read more
Get Rid of the Wooden Pick and Other Neanderthal Approaches for Rework of Underfilled Components
Multiple Electronics Markets are driving the growing need for components with higher performance in smaller form factors with higher pin count and greater reliability.
Ball Grid Ar
.. read more
A Novel Approach to Evaluate the Impact on Solder Joint Reliability due to Multiple BGA Rework
PCB assemblies with numerous BGAs often go through multiple BGA reworks but there is not much data to suggest its effect
on the long term solder joint reliability of the BGAs. This study is foc
.. read more
Lead Free BGA Rework: A comparison of the effect on reliability of reworked BGAs that have been processed with solder...
The use of the Area Array Package and in particular,Ball Grid Array (BGA) technology in the electronics industry continues
to increase due to the fact that this package type allows for a greate
.. read more
Effects of BGA Rework on Board-Level Reliability
The research goal was to establish a limit for the number of rework cycles for Ball Gird Arrays (BGAs) and to determine the clearance required between a BGA and its surrounding components on
.. read more
Non-Destructive BGA Rework Using Infrared Heating Technology
During the past few years, it has become increasingly difficult to physically rework printed circuit board (PCB) assemblies. Such mundane operations as soldering, desoldering and component r
.. read more
Get Rid of the Wooden Pick and Other Neanderthal Approaches for Rework of Underfilled Components
Multiple Electronics Markets are driving the growing need for components with higher performance in smaller form factors with higher pin count and greater reliability.
Ball Grid Ar
.. read more
A Novel Approach to Evaluate the Impact on Solder Joint Reliability due to Multiple BGA Rework
PCB assemblies with numerous BGAs often go through multiple BGA reworks but there is not much data to suggest its effect
on the long term solder joint reliability of the BGAs. This study is foc
.. read more
Lead Free BGA Rework: A comparison of the effect on reliability of reworked BGAs that have been processed with solder...
The use of the Area Array Package and in particular,Ball Grid Array (BGA) technology in the electronics industry continues
to increase due to the fact that this package type allows for a greate
.. read more