Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Fluxes Suppressing Non-Wet-Open at BGA Assembly
With the advancement in miniaturization, the die is getting thinner and the solder balls are getting smaller for BGAs. Consequently, the thermal warpage is getting more severe due to the mis
.. read more
System in Package (SiP) and CSPs Underfilling on Reliability
This paper presents assembly challenges and reliability evaluation by thermal cycling for a 2.5D [aka, System in Package (SiP)]in a fine pitch ball grid array (FPBGA). More importantly, it p
.. read more
Effects of Temperature Uniformity on Package Warpage
Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfa
.. read more
Selective Reflow Rework Process
In the rework environment,most equipment and procedures are designed for low volume repair/rework process. When a high volume rework is needed,the challenges begin. For example,a long cycle tim
.. read more
Fluxes Suppressing Non-Wet-Open at BGA Assembly
With the advancement in miniaturization, the die is getting thinner and the solder balls are getting smaller for BGAs. Consequently, the thermal warpage is getting more severe due to the mis
.. read more
System in Package (SiP) and CSPs Underfilling on Reliability
This paper presents assembly challenges and reliability evaluation by thermal cycling for a 2.5D [aka, System in Package (SiP)]in a fine pitch ball grid array (FPBGA). More importantly, it p
.. read more
Effects of Temperature Uniformity on Package Warpage
Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfa
.. read more
Selective Reflow Rework Process
In the rework environment,most equipment and procedures are designed for low volume repair/rework process. When a high volume rework is needed,the challenges begin. For example,a long cycle tim
.. read more