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JEITA’s Standardization Activity of 2nd Generation Lead-Free Solder Paste

1.Obtain suggestions from the solder manufactures Low-Ag SAC Paste •Increase in reflow temp •Impact on thermal fatigue and wetting Sn-Bi low-temp Paste •Impact on shock strength •Creep fatigue .. read more

Influence of Microstructure on Mechanical Behavior of Bi-Containing Pb-Free Solders

SAC-Bi and Sn-Ag-Bi alloys have demonstrated superior performance in thermal cycling reliability tests of printed circuit boards,such as the National Center for Manufacturing Sciences programs .. read more

Development of a Lead-Free Alloy for High-Reliability,High-Temperature Applications

Though the electronics industry is nearing the 3-year anniversary marking the ban of lead from electronics products,several challenges still remain with existing lead-free materials for certain .. read more

The New Lead Free Assembly Rework Solution Using Low Melting Alloys

This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla .. read more

Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead

A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been .. read more

JEITA’s Standardization Activity of 2nd Generation Lead-Free Solder Paste

1.Obtain suggestions from the solder manufactures Low-Ag SAC Paste •Increase in reflow temp •Impact on thermal fatigue and wetting Sn-Bi low-temp Paste •Impact on shock strength •Creep fatigue .. read more

Influence of Microstructure on Mechanical Behavior of Bi-Containing Pb-Free Solders

SAC-Bi and Sn-Ag-Bi alloys have demonstrated superior performance in thermal cycling reliability tests of printed circuit boards,such as the National Center for Manufacturing Sciences programs .. read more

Development of a Lead-Free Alloy for High-Reliability,High-Temperature Applications

Though the electronics industry is nearing the 3-year anniversary marking the ban of lead from electronics products,several challenges still remain with existing lead-free materials for certain .. read more

The New Lead Free Assembly Rework Solution Using Low Melting Alloys

This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla .. read more

Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead

A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been .. read more