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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the second of two papers discussing the companies Lower Melt Alloy program. The first paper was presented at IPC APEX2013. The program explores the manufacturability and reliabili
.. read more
Sample Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics,the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfec
.. read more
JEITA’s Standardization Activity of 2nd Generation Lead-Free Solder Paste
1.Obtain suggestions from the solder manufactures
Low-Ag SAC Paste
•Increase in reflow temp
•Impact on thermal fatigue and wetting
Sn-Bi low-temp Paste
•Impact on shock strength
•Creep fatigue
.. read more
Influence of Microstructure on Mechanical Behavior of Bi-Containing Pb-Free Solders
SAC-Bi and Sn-Ag-Bi alloys have demonstrated superior performance in thermal cycling reliability tests of printed circuit boards,such as the National Center for Manufacturing Sciences programs
.. read more
Development of a Lead-Free Alloy for High-Reliability,High-Temperature Applications
Though the electronics industry is nearing the 3-year anniversary marking the ban of lead from electronics products,several
challenges still remain with existing lead-free materials for certain
.. read more
Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. read more
Microstructure and Properties of Sn-Pb Solder Joints with Sn-Bi Finished Components
For this study,researchers from the University of Toronto produced samples of Sn-Pb solder,with additions of bismuth,
solidified at controlled cooling rates. The microstructure of the various B
.. read more
Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the second of two papers discussing the companies Lower Melt Alloy program. The first paper was presented at IPC APEX2013. The program explores the manufacturability and reliabili
.. read more
Sample Preparation for Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics,the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfec
.. read more
JEITA’s Standardization Activity of 2nd Generation Lead-Free Solder Paste
1.Obtain suggestions from the solder manufactures
Low-Ag SAC Paste
•Increase in reflow temp
•Impact on thermal fatigue and wetting
Sn-Bi low-temp Paste
•Impact on shock strength
•Creep fatigue
.. read more
Influence of Microstructure on Mechanical Behavior of Bi-Containing Pb-Free Solders
SAC-Bi and Sn-Ag-Bi alloys have demonstrated superior performance in thermal cycling reliability tests of printed circuit boards,such as the National Center for Manufacturing Sciences programs
.. read more
Development of a Lead-Free Alloy for High-Reliability,High-Temperature Applications
Though the electronics industry is nearing the 3-year anniversary marking the ban of lead from electronics products,several
challenges still remain with existing lead-free materials for certain
.. read more
Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. read more
Microstructure and Properties of Sn-Pb Solder Joints with Sn-Bi Finished Components
For this study,researchers from the University of Toronto produced samples of Sn-Pb solder,with additions of bismuth,
solidified at controlled cooling rates. The microstructure of the various B
.. read more