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Designing a High Performance Electroless Nickel and Immersion Gold to Maximize Highest Reliability
The latest highest reliability requirements demand a high performance electroless nickel and immersion gold (HP ENIG). The new IPC specification 4552A has refocused the industry with referen
.. read more
A Novel Electroless Nickel Immersion Gold (ENIG) Surface Finish for Robust Solder Joints and Better Reliability of Electronic Assemblies
Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to brittle solder joints failures. Due to these reasons, there are field failures and reliabi
.. read more
Enig – Corrosion: The Status, The Risks and The Solutions
The ENIG finish is one of the most common final finishes finding broad acceptance in the market for decades. ENIG is the abbreviation for “electroless nickel – immersion gold” where it is th
.. read more
Non‐Destructive Measurement Improvements in Determining the Phosphorus Content in Electroless Nickel Deposits for ENIG And ENEPIG Using XRF
Phosphorus content in electroless nickel deposits, for PCB and electronic connectors, is a critical factor in controlling the nickel layer’s corrosion resistance and solderability. Improveme
.. read more
ENEPIG -How the Process Characteristics Influence the Layer Performance
Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) is a well-accepted and established finish for high performance applications. The properties of the coating are determined mai
.. read more
Quantitative Analysis of Corrosion Resistance for Electroless Ni-P Plating
An electroless nickel (EN) layer is frequently used in various industrial applications. Commonly it is used as the barrier layer in electroless nickel/immersion gold (ENIG) as a solderability p
.. read more
Black Pad and Revisiting Methodologies
Society today relies on electronic devices that influence every aspect of our lives,such as communication,transportation,computing,home appliances,and recreation. The reliability of any electro
.. read more
Designing a High Performance Electroless Nickel and Immersion Gold to Maximize Highest Reliability
The latest highest reliability requirements demand a high performance electroless nickel and immersion gold (HP ENIG). The new IPC specification 4552A has refocused the industry with referen
.. read more
A Novel Electroless Nickel Immersion Gold (ENIG) Surface Finish for Robust Solder Joints and Better Reliability of Electronic Assemblies
Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to brittle solder joints failures. Due to these reasons, there are field failures and reliabi
.. read more
Enig – Corrosion: The Status, The Risks and The Solutions
The ENIG finish is one of the most common final finishes finding broad acceptance in the market for decades. ENIG is the abbreviation for “electroless nickel – immersion gold” where it is th
.. read more
Non‐Destructive Measurement Improvements in Determining the Phosphorus Content in Electroless Nickel Deposits for ENIG And ENEPIG Using XRF
Phosphorus content in electroless nickel deposits, for PCB and electronic connectors, is a critical factor in controlling the nickel layer’s corrosion resistance and solderability. Improveme
.. read more
ENEPIG -How the Process Characteristics Influence the Layer Performance
Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) is a well-accepted and established finish for high performance applications. The properties of the coating are determined mai
.. read more
Quantitative Analysis of Corrosion Resistance for Electroless Ni-P Plating
An electroless nickel (EN) layer is frequently used in various industrial applications. Commonly it is used as the barrier layer in electroless nickel/immersion gold (ENIG) as a solderability p
.. read more
Black Pad and Revisiting Methodologies
Society today relies on electronic devices that influence every aspect of our lives,such as communication,transportation,computing,home appliances,and recreation. The reliability of any electro
.. read more