Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Microvia Weak Interfacial Fracture of Microvia Designs-Comparing the Reliability of Graphite-based Direct Metallization and Conventional Electroless Copper-Phase 1
Documentation shows that there are latent reliability issues with stacked filled Microvia designs for complex printed circuit boards. This issue is broadly defined as a weak interface betwee
.. read more
High Throw Electroless Copper - Enabling new Opportunities for IC Substrates and HDI Manufacturing
Two new electroless copper baths have been developed to cope with upcoming miniaturization challenges in the high-end IC substrate segment as well as in the evolving HDI board market. The main
.. read more
Blind Micro Via and Through Hole Filling in Horizontal Conveyorised Production System
This paper presents a novel electrolytic copper panel plate system incorporating equipment and specially developed electrolyte which enables filling of blind micro vias with a minimum of surfac
.. read more
Microvia Weak Interfacial Fracture of Microvia Designs-Comparing the Reliability of Graphite-based Direct Metallization and Conventional Electroless Copper-Phase 1
Documentation shows that there are latent reliability issues with stacked filled Microvia designs for complex printed circuit boards. This issue is broadly defined as a weak interface betwee
.. read more
High Throw Electroless Copper - Enabling new Opportunities for IC Substrates and HDI Manufacturing
Two new electroless copper baths have been developed to cope with upcoming miniaturization challenges in the high-end IC substrate segment as well as in the evolving HDI board market. The main
.. read more
Blind Micro Via and Through Hole Filling in Horizontal Conveyorised Production System
This paper presents a novel electrolytic copper panel plate system incorporating equipment and specially developed electrolyte which enables filling of blind micro vias with a minimum of surfac
.. read more