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Mechanical Bending Technique for Determining CSP Design and Assembly Weaknesses
A cyclic board-bending technique has been developed to ensure a reproducible multiaxial stress state at the Chip
Size Package (CSP) solder fillet. Mechanically stressing the package serves as a
.. read more
Mechanical Bending Technique for Determining CSP Design and Assembly Weaknesses
A cyclic board-bending technique has been developed to ensure a reproducible multiaxial stress state at the Chip
Size Package (CSP) solder fillet. Mechanically stressing the package serves as a
.. read more