Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Board Level Reliability Testing of RF Packages
Board level reliability testing is becoming a requirement amongst users for acceptance of components and packages. Standard component level JEDEC tests are not sufficient to qualify a suppli
.. read more
Enhancing Printed Circuit Board Layout Using Thermo-Mechanical Analysis
The use of high performance electronic assemblies in harsh environments subject solder interconnects to complex loading conditions that are primarily driven by the behavior of circuit card asse
.. read more
Evaluation of Underfill Material on Board Level Reliability Improvement of Wafer Level CSP Component
In recent years,Wafer Level Chip Scale Packages (WLCSP) are used not only in the hand held devices but also in high-end
networking and telecommunication products. Due to their small footprint a
.. read more
An Efficient Test Model to Study the Board Level Reliability For High I/O Flip Chip BGA Packages
With the increasing demands of complex functions in a single chipset or microprocessor,the development of large
size high I/O Flip Chip BGA (FCBGA) package becomes very important in recent year
.. read more
Board Level Interconnect Reliability Assessment of High I/O BGA Packages
To meet the complex design requirements of the electronics industry,there is an increased need for large size high
I/O BGA packages. The size of these large BGA packages (up to 50 mm2 and 1157+
.. read more
Board Level Reliability Testing of RF Packages
Board level reliability testing is becoming a requirement amongst users for acceptance of components and packages. Standard component level JEDEC tests are not sufficient to qualify a suppli
.. read more
Enhancing Printed Circuit Board Layout Using Thermo-Mechanical Analysis
The use of high performance electronic assemblies in harsh environments subject solder interconnects to complex loading conditions that are primarily driven by the behavior of circuit card asse
.. read more
Evaluation of Underfill Material on Board Level Reliability Improvement of Wafer Level CSP Component
In recent years,Wafer Level Chip Scale Packages (WLCSP) are used not only in the hand held devices but also in high-end
networking and telecommunication products. Due to their small footprint a
.. read more
An Efficient Test Model to Study the Board Level Reliability For High I/O Flip Chip BGA Packages
With the increasing demands of complex functions in a single chipset or microprocessor,the development of large
size high I/O Flip Chip BGA (FCBGA) package becomes very important in recent year
.. read more
Board Level Interconnect Reliability Assessment of High I/O BGA Packages
To meet the complex design requirements of the electronics industry,there is an increased need for large size high
I/O BGA packages. The size of these large BGA packages (up to 50 mm2 and 1157+
.. read more