Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Board Thickness Effect on Accelerated Thermal Cycle Reliability
This paper compares the thermal cycling performance of a quad flat no-lead (QFN) component and three different ball grid array (BGA) components assembled onto printed circuit board test vehi
.. read more
Reliability Performance of Very Thin Printed Circuit Boards with regard to Different any-Layer Manufacturing Technologies
The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches,which can be used f
.. read more
The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains
The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates.
Newly developed laminates have different curing processes,are commonly fil
.. read more
PCB Board Design Considerations for Impedance Control and Optimal Signal Integrity in High Speed Digital and RF Systems
For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si
.. read more
Weigh/Bake/Weigh Testing To Determine Moisture Content in Printed Boards
Entrapped moisture within printed boards can expand during soldering operations,causing delamination or other damage. Available methods for determining moisture content may be destructive
or no
.. read more
The Value of IPC-2152
Current carrying capacity in printed board design is technology dependent and an element of printed circuit board thermal
management. Conductor temperature rise as a function of current is depe
.. read more
Bare Board Material Performance after Pb-Free Reflow
The High Density Packaging Users Group (HDPUG) consortia completed an extensive study of 29 different bare board material and stackup combinations and their associated performance after 6X Pb-f
.. read more
FEA Study of Solder Hole Fill Impact on the Reliability of PTH Solder Joints
This paper is focused on the impact of solder hole fill on the reliability of the plated-through-hole (PTH) solder joints with different board thicknesses. Finite element analysis (FEA) is empl
.. read more
Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. read more
The Study of High Density PCB Reliability
The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20%
.. read more
Effect of OSP Chemistry on the Hole Fill Performance During Pb-free Wave Soldering
This paper analyzes the differences in plated through hole fill performance between the regular OSP and Pb-free OSP PCB surface finish chemistries in a Pb-free wave solder process. The variable
.. read more
Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection
Electronic products are being stressed by increasing operating temperatures and higher assembly temperatures. Silicon and
product power consumption are increasing as the silicon densities and s
.. read more
Investigating Compliant Tooling Solutions within a Mass Imaging Process
The printing process is always highlighted as contributing the most process defects to a surface mount manufacturing
production facility; typical values presented are around the 60% range. Fact
.. read more
Methodology for High Aspect Ratio Pulse Plating
Two years ago when IBM Endicott,now Endicott Interconnect (EI),was preparing to install a new Acid Copper
plating system,the Periodic Reverse Pulse (PRP) tanks installed at the end of the line
.. read more
Board Level Interconnect Reliability Assessment of High I/O BGA Packages
To meet the complex design requirements of the electronics industry,there is an increased need for large size high
I/O BGA packages. The size of these large BGA packages (up to 50 mm2 and 1157+
.. read more
Mechanical Reliability of Fine Pitch Packages for use in Server and Mobile Electronic Packages
In both the server and portable electronic markets,monotonic mechanical overstress has become a primary issue in
manufacturing and field usage. Appropriate test methods,including four point ben
.. read more
Current Carrying Capacity in Printed Circuits,Past,Present and Future
In the present as in the past,printed circuit board conductors are sized using simple charts that are a function of
cross-sectional area,current level and conductor temperature rise. These char
.. read more
Board Thickness Effect on Accelerated Thermal Cycle Reliability
This paper compares the thermal cycling performance of a quad flat no-lead (QFN) component and three different ball grid array (BGA) components assembled onto printed circuit board test vehi
.. read more
Reliability Performance of Very Thin Printed Circuit Boards with regard to Different any-Layer Manufacturing Technologies
The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches,which can be used f
.. read more
The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains
The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates.
Newly developed laminates have different curing processes,are commonly fil
.. read more
PCB Board Design Considerations for Impedance Control and Optimal Signal Integrity in High Speed Digital and RF Systems
For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si
.. read more
Weigh/Bake/Weigh Testing To Determine Moisture Content in Printed Boards
Entrapped moisture within printed boards can expand during soldering operations,causing delamination or other damage. Available methods for determining moisture content may be destructive
or no
.. read more
The Value of IPC-2152
Current carrying capacity in printed board design is technology dependent and an element of printed circuit board thermal
management. Conductor temperature rise as a function of current is depe
.. read more
Bare Board Material Performance after Pb-Free Reflow
The High Density Packaging Users Group (HDPUG) consortia completed an extensive study of 29 different bare board material and stackup combinations and their associated performance after 6X Pb-f
.. read more
FEA Study of Solder Hole Fill Impact on the Reliability of PTH Solder Joints
This paper is focused on the impact of solder hole fill on the reliability of the plated-through-hole (PTH) solder joints with different board thicknesses. Finite element analysis (FEA) is empl
.. read more
Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. read more
The Study of High Density PCB Reliability
The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20%
.. read more
Effect of OSP Chemistry on the Hole Fill Performance During Pb-free Wave Soldering
This paper analyzes the differences in plated through hole fill performance between the regular OSP and Pb-free OSP PCB surface finish chemistries in a Pb-free wave solder process. The variable
.. read more
Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection
Electronic products are being stressed by increasing operating temperatures and higher assembly temperatures. Silicon and
product power consumption are increasing as the silicon densities and s
.. read more
Investigating Compliant Tooling Solutions within a Mass Imaging Process
The printing process is always highlighted as contributing the most process defects to a surface mount manufacturing
production facility; typical values presented are around the 60% range. Fact
.. read more
Methodology for High Aspect Ratio Pulse Plating
Two years ago when IBM Endicott,now Endicott Interconnect (EI),was preparing to install a new Acid Copper
plating system,the Periodic Reverse Pulse (PRP) tanks installed at the end of the line
.. read more
Board Level Interconnect Reliability Assessment of High I/O BGA Packages
To meet the complex design requirements of the electronics industry,there is an increased need for large size high
I/O BGA packages. The size of these large BGA packages (up to 50 mm2 and 1157+
.. read more
Mechanical Reliability of Fine Pitch Packages for use in Server and Mobile Electronic Packages
In both the server and portable electronic markets,monotonic mechanical overstress has become a primary issue in
manufacturing and field usage. Appropriate test methods,including four point ben
.. read more
Current Carrying Capacity in Printed Circuits,Past,Present and Future
In the present as in the past,printed circuit board conductors are sized using simple charts that are a function of
cross-sectional area,current level and conductor temperature rise. These char
.. read more