Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Tolerance Mistaken: Impacts of not properly addressing material, industry standards and assembly process limitations
As electronic assembly designs have increased in density and component packaging size and lead pitch have decreased in size, this has placed tighter requirements on manufacturing processes.
.. read more
Component Packaging Technologies And Printed Board Design Driven SMT Assembly Yields Issues
This slide show discusses the different categories of SMT components including, BTCs, dual and quad leaded packages, and passives. The component use cases and typical challenges are ex
.. read more
Selective Soldering with Alternative Lead-Free Alloys
The electronics industry is still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling. Alternative alloys
.. read more
Impact of PCB Manufacturing, Design, and Material to PCB Warpage
Customer demands for smaller form factor electronic devices are driving the use of thinner electronic components and thinner printed circuit boards (PCB) in the assembly process. The use of
.. read more
Board Warpage During Reflow Soldering - Need for Board Support?
In the high temperatures during board assembly reflow soldering,the base material becomes soft and there is a severe risk for permanent warpage. There are many parameters that could affect boar
.. read more
Low Temperature SMT Process Implementation
Low Temperature Conversion
•Substantial cost savings over regular processes
•Savings can outweigh paste cost differences
•Can be mechanically stronger if done right
•Involves more than just cha
.. read more
Tolerance Mistaken: Impacts of not properly addressing material, industry standards and assembly process limitations
As electronic assembly designs have increased in density and component packaging size and lead pitch have decreased in size, this has placed tighter requirements on manufacturing processes.
.. read more
Component Packaging Technologies And Printed Board Design Driven SMT Assembly Yields Issues
This slide show discusses the different categories of SMT components including, BTCs, dual and quad leaded packages, and passives. The component use cases and typical challenges are ex
.. read more
Selective Soldering with Alternative Lead-Free Alloys
The electronics industry is still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling. Alternative alloys
.. read more
Impact of PCB Manufacturing, Design, and Material to PCB Warpage
Customer demands for smaller form factor electronic devices are driving the use of thinner electronic components and thinner printed circuit boards (PCB) in the assembly process. The use of
.. read more
Board Warpage During Reflow Soldering - Need for Board Support?
In the high temperatures during board assembly reflow soldering,the base material becomes soft and there is a severe risk for permanent warpage. There are many parameters that could affect boar
.. read more
Low Temperature SMT Process Implementation
Low Temperature Conversion
•Substantial cost savings over regular processes
•Savings can outweigh paste cost differences
•Can be mechanically stronger if done right
•Involves more than just cha
.. read more